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Authors with accepted abstract(s) are requested to provide their submission for full-length manuscript(s) for two different applications: The first application (I) will serve for the Conference Book Proceedings. The second application (II) is for inclusion in a CD-ROM library which IMAPS is creating that will include all papers published by IMAPS in the Conference Proceedings. Additionally, it will be used for some revised papers selected to be included in the International Journal of Microcircuits and Electronic Packaging. Both formats are required for publication in the Proceedings. Submissions should be directed to:

Jackki Morris
Mgr., Technical Programs
International Microelectronics And Packaging Society (IMAPS)
1850 Centennial Park Drive, Suite 105
Reston, Virginia 20191-1517
Phone: 703-758-5164; Fax: 703-758-1066

Presentation Time: 20 minutes for Presentation and 5 minutes for Questions and Answers.

A. Procedure for Conference Book Proceedings

  • All illustrations and tables must be referred to in the text.
  • Standard symbols and abbreviations must be used. All abbreviations must be defined when first used in the text. All subscripts, superscripts, Greek and other foreign letters, and mathematical symbols must be clearly rendered.
  • The use of trade and company names and proprietary terms should be avoided.
  • All dimensions are to use SI units, and English units may follow in parenthesis.
  • References are placed at the end of the paper, not as footnotes.
  • Submit a camera-ready original of the manuscript, plus two (2) copies.
  1. The submitted paper copy should be camera ready for direct publication into the Conference Proceedings. All figures should be inserted into the two column format as you want them to appear.
  2. Reference all illustrations and tables. The initial reference to illustrations and tables in the text should be numerically sequential (e.g. Table 1, Table 2, Figure 1, Figure 2, Equation (1), Equation (2), etc.)
  3. References appear as a separate section at the end of the paper. In the text, the reference information is indicated by a numeral in a square bracket (e.g. [1]). Examples of correct references are included in the Manuscript Preparation Guidelines.
  4. A signed Agreement for Transfer of Copyright must accompany the paper. The paper must be approved and cleared for release by the company/institution/foundation prior to its submission. The Agreement for Transfer of Copyright is for all further IMAPS publication rights to the author's paper, including publication in the Symposium Proceedings, the CD-ROM library, and if selected, The International Journal of Microcircuits and Electronic Packaging.

B. Procedure for Storage on CD-ROM

The electronic version of your paper may be provided on a 3.5" disk (Zip or magnetoptic) or by E-mail to: Preferred formats are MSWord, WordPerfect and WordPro. MAC users must save their document as IBM format on a high-density diskette.

  1. Figures should be saved in GIF format if possible, otherwise authors may use JPEG, PCX, WMF, TIFF, BMP, EPS, DRW, or PICT.
  2. Hard copies of figures should be included for scanning purposes.
  3. Hard copies of Tables should also be included, each on a separate piece of paper, for scanning purposes.
  4. Original drawings should be on 8x11" drawing vellum or board or, printed with a high resolution laser printer.
  5. Only the coordinate axes for graphs should be shown.
  6. Photographs should be glossy prints of good contrast. Slides and negatives are not acceptable. Avoid using color prints. Tag the back of the photos with the author's name and figure number. Indicate the top of each photo by printing "top" in the appropriate margin.

Questions regarding preparation of disk for CD-ROM storage may be directed to:

Dwayne Williams
1850 Centennial Park Drive, Suite 105
Reston, VA 20191-1517
Phone: 703-758-5165; Email:
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IMAPS-International Microelectronics and Packaging Society
1850 Centennial Park Drive, Suite 105, Reston, VA 20191-1517
Phone: 888-464-6277 or 703-758-1060; Fax: 703-758-1066
The Microelectronics And Packaging Society

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