Make your own free website on Tripod.com


IMAPS 2000 International Symposium & Exhibition
Chapter Profiles
Call for Papers
Advanced Educational Opportunities
Employment Opportunities Marketplace
IMAPS Educational Foundation
Microelectronics Marketing Research Council
IMAPS Ceramic Interconnection Initiative
Discussion Boards
IMAPS National Leadership
Press Room
Advertising Opportunities
Contact IMAPS
Site Search
IMAPS FAQ



MARKETPLACE

Last updated 7/27/99.


POSITIONS WANTED

LOOKING FOR OLD PROCEEDINGS & JOURNALS - WILL BUY! - I am looking for the following proceedings and International Journal of Microcircuits and Electronic Packaging Proceedings: IEPS '92, ECC '61, '63, '71, '72, '73, '75, '76, '77, '78, '81, '82; Journal: '85 - 4th Quarter, '86 - 3rd & 4th Quarters, '91 - 1st Quarter. Will pay for these publications.
Please contact: John Graves, Ph: 410-239-6872; E-Mail: jgraves303@aol.com

ASSEMBLY PROCESS ENGINEER - Seeking assembly process engineering position due to pending plant closure of medical device manufacturing facility. 10+ years experience with wire bonding, screen printing, die attach, epoxy dispensing. Primary responsibility the last several years has been wire bonding.
Please contact: Jim Kappler, Ph:409-848-4905, E-mail: jimk@mails.imed.com

CHINA OPPORTUNITY - Recently returning China ex-pat with 20 years of international marketing experience, 14 years in China, seeks to start a new business as an employee or under contract for a progressive company wanting to enter the China market. Technology specialties are: Electronic Materials (chemicals, thick film pastes, glasses), Electronic Components & Circuits, Glass Technology (compositions, fibers, powders), Metal Powders (precious metals, base metals, refractory metals), Technical Ceramics, Equipment For The Above (testing, Production). Fellow and Charter Member of ISHM (IMAPS); Member of Glass and Electronic Divisions, American Ceramic Society over 30 years.
Write: Consultant, P.O. Box 91554, Santa Barbara, CA 93190-1554, E-mail: jaybird@pocketmail.com

CONSULTANT - High technology professional with over 30 years experience in all phases of hybrid microelectronic manufacturing, engineering and quality assurance. Skilled in application of process improvement methodologies, problem analysis, troubleshooting, and personnel training. Certified Quality Engineer and Certified Quality Auditor by American Society for Quality. Now available for short term assignments. References on request. (Security classification available to qualified agencies.)
For more information contact: Phillip E. Kenney, 3108 Winchester Way, Fallston, MD 21047. Phone: 410-877-2838 E-Mail: kenneyp@worldnet.att.net

CONSULTANT - Mechanical Engineering, dynamic, task-oriented, offers over twenty years of diversified hi-tech experience as a design/project/program manager/engineer in R&D/product development/system/engineering, in Electronics, Instrumentation, Semiconductor Wafer Processing Equipment, Computer Peripherals, Medical and Laboratory Equipment, Laser Applications, Industrial Automation. Emphasis on Vacuum Systems, Precision Mechanisms, Robotics and Micro-contamination reduction. Extensive experience in component design, material selection, system integration and testing, electronics packaging, also project management and implementation of R&D concepts in production. Clients include Xerox Corp., Beckman Instruments Inc., Applied Materials Inc., Watkins-Johnson Co. and Seagate Technology Inc. Registered Professional Engineer, California License M025540. Preferred area: western US.
Contact: P E T R U N. N I T E S C U, PE, Ph.D., 687 Berkshire Place, Milpitas, CA 95035, Tel. (408) 956-0535, E-mail: pnnco@pacbell.net, Homepage: http://home.pacbell.net/pnnco.

CONSULTANT/HYBRID MICROELECTRONICS - 30 years of hands on experience in the hybrid industry. 1996 IMAPS John A. Wagnon Award Winner. Hard and semi-rigid substrates, single and mulitlayer hybrids. Thin and thick film RF/microwave hybrids. Proven record of accomplishment in developing manufacturable, marketable products. Over 30 publications. Most recent - "Thin Film for Microwave Hybrids" in Thin Film Technology Handbook, A. Elshabini and F.D. Barlow III, eds. McGraw Hill, 1998.
Richard Brown, 397 Woodridge, P.O. Box 2286, Shelton, CT 06484. Phone/Fax: 203-925-8908, email: rbrown-consultant@att.net

DIRECTOR OF OPERATIONS - Director of Operations offering over twenty years management experience in Manufacturing, Operations and/or Engineering supporting multi plant facilities. Technologies include all phases of plastic rigid PVC calendering and thermoforming, Coil Winding, High Volume Electronic Manufacturing of Printed Circuit Board assemblies and Thick Film/Hybrid Networks, Machinery design, fabrication, and assembly, and other final product assembly. I have solid performance in budgeting, scheduling, coordinating, organizing, communications; identifying and implementing cost reduction programs and inspiring teamwork. I am familiar with MBO, SPC, DOE, DFM, MRP, ISO, and JIT concepts. I have a Masters in Business Administration and Bachelors in Electronic Engineering Technology. I would like to put my talents and experience to work for a progressive company that is interested in increased profitability, organization, team development and growth. I would prefer to stay in the Chicago Metro area. Edward J. Kus, Phone: 630-858-2302, Fax: 630-858-6330.

EPOXY CONSULTANT - For formulating, processing, and reliability problems of epoxy resins and other thermosets. Have databases on starting formulations and most commercial epoxy resin formulations. Potting, glob top, transfer molding, conformal coatings, adhesion, and lamination.
Contact: Dr. J. C. Spitsbergen, 696 Knollwood Road, Franklin Lakes, NJ 07417. Phone (201) 848-1444.

FLEX CIRCUIT CONSULTANT - Noted Engineer and inventor in flexible and rigid-flex circuitry with unmatched experience in product and processes and 21 patents. Author of numerous papers and articles and Flexible Printed Circuitry (McGraw-Hill, '96). Workshop Instructor for IPC and Uwisc Engineering Extension.
Contact: Thomas H. Stearns, 603-889-2522, e-mail: thomas.stearns@mcione.com ; Web page: SMTnet.com/flex. Web page: SMTnet.com/flex.

GENERAL MANAGEMENT - I am currently self-employed as a technical and/or management consultant but seek permanent employment in general management of a technologically-based company. Specifically, I am searching for a position at the director or senior executive level in operations, quality and reliability engineering, or corporate development. The ideal position should be compensated at the six-figure level plus a negotiated signing agreement. Employment should be permanent if the responsibilities of the position are continuing; otherwise, the fee for a single project such as QS9000 implementation or Y2K will be negotiated. I am primarily seeking to be employed in the northern portion of the 972 or 214 area codes. However, if employment is outside either of these two area codes, both the relocation package and salary requirements are subject to negotiation.
If interested please contact: Roger Cadenhead, 972 417-7081, rcadenhe@airmail.net

MANAGER/TECHNICAL PROCUREMENT SPECIALIST - MICROELECTRONICS - Seeking materials/procurement manager position in an aggressive hybrid/ASIC manufacturing environment. 20+ years manufacturing procurement experience, both military and commercial. BS Degree. I.E., MFG., knowledge of FARS.DARS/UCC. Thick and Thin Film experience. Team player. NJ resident. Willing to relocate, if opportunity is right.
Ronald A. Sticco, 201-967-1225 (Phone/Fax), consultssp@hotmail.com

TECHNICAL CONSULTANT IMAPS Fellow of the Society, BSEE/MSEE with 22 years experience in design, development, and manufacture of single chip, hybrid, and MCM products. Specializing in program turn-around, product risk management, and facility start-up.
Contact: Vernon Powers, 3985 Heathwood Lane, Norcross, GA 30092, Phone/Fax: (770) 449-6161, E-mail: vpowers@ix.netcom.com.

THERMAL MANAGEMENT CONSULTANTS - Experts in the thermal analysis of electronic components and systems. Specializing in forced convection, natural convection and radiation cooling, for indoor and outdoor enclosure applications for the telecommunications, defense, industrial controls and power supply industries. The president and founder of Odegos Technology, Inc., with over 20 years of experience in the thermal management fields in both commercial and military environments. I hold a M.S. degree from Illinois Institute of Technology and a B.S. degree in Aerospace Engineering, from the University of Texas, Austin.
For more information: Petros Kyprios, M.S.M.E., P.E., President, Odegos Technology, Inc., 4433 Denver Drive, Plano, TX 75093, Phone: 972-596-5954, Fax : 972- 867-0993, E-mail: odegos@cyberramp.net


POSITIONS AVAILABLE

CAD DESIGNER - Remtec, Inc., a fast growing manufacturer of metallized ceramic substrates and packages is currently seeking CAD Designers. The qualified candidate will create hybrid layouts and develop detailed documentation and mechanical drawings for the manufacturing of metallized ceramic. The position requires a minimum of 3 to 5 years CAD experience and the ability to work rapidly with high accuracy and attention to detail. Requires an understanding of Hybrid/PCB design and AutoCAD 14 Software. On the job training is provided to qualified candidates. We offer a competitive salary and benefits package.
Contact Brian Bogie @ 781-762-9191 or send your resume by fax 781-762-9777, e-mail: remtec@tiac.net, or in writing to: Remtec, Inc. 51 Morgan Drive, Norwood, MA 02062.

DIRECTOR OF BUSINESS DEVELOPMENT/TEST AND MEASUREMENT - Position Summary: Plan and Lead business development efforts in the instrumentation industry (with a special emphasis on the medical instrumentation industry), for this Oregon-base employer that specializes in the design, testing and manufacturing of Advanced Packaging Solutions to include Hybrids, MCMs and High Density Packages. Influence employer's product lines based upon thorough market analysis. Form collaborative, profitable long-term relations with customers. Candidate Requirements: Technical degree with MS or Ph.D. required. Ten to fifteen years in the test instrumentation industry, well connected in the instrumentation industry, a strategic professional who tends to operate with a consistent sense of urgency, a thorough understanding of the core technology issues and trends in the test instrumentation industry, an ability to listen and precisely understand the present and future needs of customers, and ability to exercise objective reasoning, even when tired or under pressure, ability to assert ones ideas and take firm positions based upon objective market analysis, ability to work in a dynamic, fast-paced and time pressured work environment, stay abreast of industry issues and trends while anticipating customer's present and future product needs.
Interested candidates, please contact Jerry Calavan at Woodworth International at (503) 225-5000 or jcalavan@woodworth.com

DIRECTOR OF ENGINEERING - Great Lakes region electronic frequency controls manufacturer seeks Engineering Director to manage product development staff of 6. BSEE preferred. Compensation $90-105K, bonus up to 30%. We are conducting this search on a retained basis. Please MAIL resume; all responses acknowledged and kept confidential
Contact: Deb Marzinske, Recruiter, Egan & Associates, 128 S. 6th Avenue, West Bend, WI 53095.

DIRECTOR OF MARKETING - A Silicon Valley Company with sales of $45 million seeks a Director of Marketing to be responsible for product management, marketing, and sales support for the company's DC/DC and AC/DC product lines. The individual will report directly to a VP/GM and will be responsible for sales plans, forecasting, and tracking performance. Will support sales in the field and call upon major accounts primarily in the telecommunications industries. A BSEE degree is required, as well as other marketing, applications engineering or technical experience relating to DC/DC and other power supplies. Salary in the $90-100K range, plus bonus and stock options.
Please fax resume to S. Now at 414-335-0625. Please note position #165 on your correspondence.

ELECTRICAL ENGINEER - The candidate selected will provide development and design of new products, will design, analyze and troubleshoot analog and digital circuitry and will propose and implement countermeasures to ensure quality and reliability. Will confirm the design status of new models as necessary. Will also program ICs using assembly language, C, or C++. Will work closely with production departments. The selected candidate will have a BS, EE and a minimum of 6 months experience (intern or co-op) working with electrical circuits. Must be able to work in a team environment. Must be able to work in the US on a permanent basis. Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

ELECTRICAL ENGINEER - Design of electrical circuitry (both analog and digital). Will develop circuitry, investigate design issues and propose cost-effective design changes to ensure product quality and reliability. Must be able to effectively adapt to rapidly changing tasks and priorities. Will work closely with production to insure manufacturability of designs. The selected candidate must have a BS, EE and a minimum of 1 year related work experience (intern or co-op experience). Must be familiar with both analog and digital circuit design and have experience using electrical test equipment. Must be able to work in a team environment and be able to work in the United States on a permanent basis. Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

ELECTRICAL ENGINEERING SPECIALIST - Primary Duties: Develop design concepts into equipment designs. Coordinate and/or perform the design, estimation, fabrication, installation, startup and maintenance of equipment. Perform computations and engineering analysis to support design. Provide electrical documentation control for drawings, manuals and procedures for the department. Interface with contractors and vendors to achieve goals. Requirements: AS degree in Electrical Engineering or Electrical Systems Design or equivalent in experience. 4 years experience in computer-aided drafting and design (CADD). 3 years experience with Auto Cad. 6 years experience in electrical drafting of equipment systems. Knowledge and understanding of the National Electric Code. Electrical construction drafting experience a plus. Must have the ability to work in the United States on a permanent basis. Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

ELECTROPLATING/ELECTROLESS PLATING CONSULTANT - Knowledge in the whole range of electroplating materials and processes. Including gold, silver, nickel, sulfamate nickel, bright, leveling nickel plating, and other special nickel processes. Copper plating, all types, tin and tin alloys, cadmium, zinc, brass, and bronze, plating onto "difficult to plate" materials, electroless nickel, direct plating, and preparation cycles. Extensive experience in research and development in plating products and processes and practical hands on experience in memory discs, microelectronics, printed circuits, MCMs Hardware, and others. Numerous patents and over 70 papers published. Experienced expert witness deposition, testimony and reports.
Don Baudrand, 621 NE Harrison St., Poulsbo, WA, 98370-8453. Phone: 360-598-2250, Fax: 360-598-5381, E-mail: donwb@tsent.com

ENGINEER - We are major Midwest producer of thick film, multichip modules, and advanced semiconductor packages. We require an experienced engineer to support our well-automated thick film production and associated areas. This position requires a four-year technical degree. The successful candidate will have at least three years experience of hands on support of thick film printing, drying, and measurement. The position will develop new processes, specify screen and process parameters, and evaluate materials for incorporation into product. Additionally, it involves troubleshooting existing processes and documenting solutions and operator responsibilities. The position requires dealing with production supervision and operators, design engineering, quality assurance, purchasing, and equipment and material suppliers. Computer literacy and demonstrated success with experimental design and analysis desired. Understanding wet photoimaging or LTCC processes is a plus.
Interested candidates should email their resume to Doug Paul at dpaul@imaps.org

ENGINEERING TEST ENGINEER - Responsibilities: This position will provide engineering support to assist with the design, implementation and maintenance of electrical jigs used in production. Requirements: The qualified candidate will have a BS in electrical engineering with a minimum of 4 years of work experience in a manufacturing environment. Must have strong PC programming skills utilizing C/C++/assembler or related language. Experience with video theory/principles a plus. Communicate effectively both written and orally. Ability to utilize engineering related equipment, tools and systems as necessary to perform job duties. Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

MANUFACTURING OPERATIONS MANAGER - MICROELECTRONICS -Dynamic, fast growing technology-based company seeks an individual with a proven record in manufacturing and operations management, including budgeting and coordinating, ability to identify and implement cost reduction programs, production planning and scheduling, material control, manpower allocations, process control, and developing the proper level of automation. The candidate must have a BS in an engineering discipline (Mechanical, Electrical, Industrial), be a process oriented individual with strong background in manufacturing engineering and have a technical background in an electronic component fabrication field (Thick Film Hybrids, Chip Resistors or Capacitors, Electronic Packaging, Printed Circuit Boards). This position is for a results orientated individual with a minimum of 10 years experience in a progressive manufacturing environment, who has a hands-on management style and strong problem solving skills. The candidate must be a team builder who can interface effectively with all levels, from top management to production workers. A demonstrated ability to lead by example, computer literacy and excellent communication skills are required. Comprehensive salary and benefits package is offered.
Please forward your resume in confidence to Doug Paul: email at dpaul@imaps.org or fax at 703-758-1066.

PACKAGING MANAGER - Location: Tucson. Must have BSEE, BSME or related field; MS degree preferred. Must have at least five years engineering management experience. Must be knowledgable with assembly processes and package development requirements. Experience with off-shore assembly subcontractors highly desired. Must have strong leadership, teamwork and communication skills.
If you'd like to join a leader in technology, please send your resume today to: Employment Manager, Burr-Brown Corporation, P.O. Box 11400, Tucson, AZ 85734, For more information call (520) 746-7829, FAX: (520) 746-7211, TDD: (520) 746-7494 Email (ASCII text only): underwood_marc@burr-brown.com EOE/M/F/H/V

PROCESS ENGINEER - BS, preferred. Must have a background in working with customers to determine best manufacturing processes. In addition this person would provide technical support to sales. Knowledge of connector & metal stamping processes required. Travel 10% US. Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

PROCESS ENGINEER - We are the "Control Over Power" world leader in power switching devices. In joining our team, you would sustain an on-going high volume Hybrid Thickfilm manufacturing and assembly process. You would also perform SMT solder reflow, aqueous cleansing process optimization, process development of new solder and polymer materials - including interface with vendors. Must be knowledge in handling conductor, resistor and dielectric materials and in firing those materials in air and nitrogen atmosphere, I.R heated furnaces. Position requires a self-starting individual that is capable of finding solutions to problems effectively and that will follow-up with well defined corrective action and documentation. Ideal candidate will have a degree in mechanical or chemical engineering or equivalent and several years of industry related experience.
Interested? Send/Fax us your resume to: L. Klers, CRYDOM CORP, 9525 Chesapeake Drive, SD, 92123, (619) 715-7299.

PROCESS ENGINEER - OMNIREL has an immediate need for a Process Engineer with 5-10 years experience in the assembly, inspection, sealing, and test of hybrid Microcircuits and MCMs. Candidate's background should include: BSME, EE, Materials, or Ceramic Engineering; Die attach - eutectic, epoxy, solder; Wirebonding (including equipment set-up and programming; Miniature welding and micro soldering; Broad knowledge of epoxies, adhesives, encapsulates, plus solder alloys; Visual inspection - using both military and industrial/commercial standards; Seam welding and solder sealing of hermetic packages; Mechanical and environmental testing of microelectronics for the purpose of process control, screening, and qualification. Die shear, bond pull tests, X-ray, leak testing, PIND, RGA, etc. Work will involve participation in both product design/development activities as well as production support. Knowledge of both small signal and power hybrids/MCMs is very desirable.
Contact: Ed Carter, Director of Process / Mfg. Engineering, 205 Crawford St., Leominister, MA 01453, Phone: 978-534-5776, ext. 341, FAX 978-537-4246 email: ecarter@omnirel.com

PROCESS ENGINEER/MANUFACTURING - MIC Technology, a leader in microelectronics circuit manufacturing is seeking two self-motivated, team oriented process engineers. Ideal candidates will have 3-5 years experience in wet chemical etching, resistor trimming, electrical test, electroplating, photolithography, laser machining and sputtering in a PCB or semiconductor manufacturing environment. BS in chemical or manufacturing engineering or equivalent experience is required. MIC offers a competitive salary, medical and dental insurance, tuition reimbursement, 401(k), profit sharing and relocation assistance.
Please send or fax your resume and salary requirements to: MIC Technology, 35 Jefferson Ave., Pearl River, NY 10965, (Located 30 miles outside NYC), (914) 735-4931, kbrewster@mic.aeroflex.com

PRODUCT DEVELOPMENT ENGINEER - Looking for person to provide technical leadership to engineering and manufacturing relating to designs, processes and product manufacturability. Must have background in QFD, TRIZ, Taguchi methods, ATS and be able to train personnel on engineering and materials modules on Oracle ERP. Must be able to work with Automation, Manufacturing, Test and Design Engineering to ensure all engineering concerns are addressed on new products and projects. Position requires Bachelor of Science in Mechanical or Electrical Engineering. Must possess 5 years of a combination of education, experience and/or training in the telecommunications industry, including switchmode power transformers.
Interested candidates may fax resumes to 605-882-8645 or email hr@midcom-inc.com Reference #712

PRODUCTION ENGINEER - CTS Corporation, Automotive Products, the world's largest manufacturer of position sensors to the automotive industry continues to grow and is seeking a qualified production engineer to provide technical support to the manufacture of non-contacting sensors. Reporting to the Manager of Production Engineering. This position will provide production engineering support to manufacturing; review and approve sign off of assembly, process, methods and design for manufacturability for new products; identify and execute continuos improvement projects; and plan and execute transfer of new products to manufacturing. Qualification for this position require three or more years experience in the manufacture of electronic sensors, active and passive laser trimming, wire bonding (large wire) epoxy application and computer skills. A bachelor's degree in Mechanical or Electrical Engineering preferred.
Please send resume to: CTS Corporation - Automotive Division, 1142 West Beardsley Avenue, Elkhart, Indiana 46514, Attn: Human Resources Manager, EOE.

PROJECT ENGINEER - MICROELETRONIC PACKAGING - We manufacture precision engineered custom hermetic electronic component packages located in Southeastern Massachusetts. Candidate should have a BS in Ceramics/Metallurgical engineering or related technical degree/experience, five years+ experience/knowledge of hermetically sealed component manufacturing and background in glass to metal or ceramic to metal sealing coupled with process experience including stamping, cleaning, annealing, etc.Candidate's duties/responsibilities to include: provide a full range of engineering services in specifying from customer drawings all materials, design layout, and manufacturing process requirements. Will be involved in all manufacturing systems including fixture design, heat treating, and chemical processing. This is an exceptional opportunity in a small privately held well-established financially successful company. The company is seeking technical talent that will assume leadership roles. Salary is open - excellent relocation package to an attractive southern New England area.
Contact Leo R. Lavoie: Ph: 401-539-7600, Fx: 401-539-6040, Email: search@ids.net

QUALITY CONTROL ENGINEER - The selected candidate will take a leadership role in the design and review of new products, will work with new and prototype sets, establishing performance standards, evaluating the sets from the viewer's standpoint for functionality and reliability. Will perform market failure analysis and recommend and implement countermeasures. The selected candidate will have a BS, EE and a minimum of 1 year experience in electronic circuit design and/or reliability testing. Must be able to work in a fast pace, team oriented environment. Must be able to work in the US on a permanent basis Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

QUALITY ENGINEER - BS Degree in Engineering and equivalent. 2 years or more of related work experience preferred. Computer experience CAD, WORD, EXCEL, CC-MAIL, preferred. Thorough knowledge of packaging engineering principal, test equipment and design structure. Responsible for packaging design (finished goods and production part). Ability to assist with new model introduction verification and testing. Ability to provide technical support to the production and material handling area. Ability to review engineering change notices prior to implementation. Practice good team skills. Must have good attendance record. Must be able to work in the US on a full-time basis. Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

QUALITY ENGINEER - Remtec, Inc., a fast growing manufacturer of metallized ceramic substrates and packages is currently seeking for Quality Engineer. Candidates should possess a BS degree in Engineering or equivalent and have 3 or more years of experience in the electronics, microelectronics, PCB or plating industries as a quality professional. We are looking for a hands on individual with the ability to resolve issues in a fast-paced, team-oriented manufacturing and engineering environment; insure proper follow-up activity and maintain survey and corrective action system. Some supervisory skills and peer-to-peer work skills are a must, as well as an ability to perform contract and new product documentation review. Computer experience (Word, Excel) required. The qualified candidate will be responsible for quality program development, yield reports and analyses, inspection procedures, vendors' quality statistical process control and design of experiments. We offer a competitive salary and benefits package.
Contact Brian Bogie @ 781-762-9191 or send your resume by fax 781-762-9777, e-mail remtec@tiac.net, or in writing to: Remtec, Inc. 51 Morgan Drive, Norwood, MA 02062.

SALES ENGINEERS - Positions for experienced Sales Engineers in Dense Memories (CA); MCM, SRAM, DRAM components (NY); Hybrid Microcircuits (MA, MO, CA, IL); and Equipment (MN, NJ, MA). For additional information check our web site at www.teksourcejobs.com
Please send resumes by e-mail attachment to himmel@redrock.net, Dick Himmel, PO Box 522, St. George, UT, 435-674-5704.

SALES MANAGER - Job Functions: Responsible for communicating with production, sales, and customers on San Diego RF and Microwave products; work with application engineers on new product development; understand/investigate customer and market trends and communicate to production; support sales on contract negotiation and customer complaint resolution; lead business discussions and decision making processes as they pertain to San Diego Metallized product. Minimum Requirements: 3-5 years sales experience in the telecommunications packaging industry; knowledge of discretes/capacitors and semiconductor products; knowledge of RF and Microwave applications strongly desired; professional level of assertiveness; proven verbal and written communication skills, including presentation skills; demonstrated initiative in solving problems; ability to resolve conflict effectively; well organized with demonstrated practice of appropriate follow up; domestic and foreign travel required. Education: Bachelor's degree or equivalent in knowledge; Engineering or Business degree preferred.
Interested candidates should contact Sean Ristine at Sean.Ristine@kyocera.com. Please mention San Diego Metallized Product Job No.: 99-208.

SALES MANAGER - A growing and successful company in contract microelectronics manufacturing, located in Santa Clara, CA, seeks a Sales Manager. This confident person will be responsible for seeking new customers, proposals/quotations, representing the company in trade show booths, managing business contacts, and building/maintaining positive relationships with customers. This creative person must have 5 years success in selling, be computer literate, have career stability, be willing to travel locally 50%, and be skilled in preparing and delivering professional presentations. Proven knowledge of chip on board, familiarity with quality/industry standards, 5 years of sales experience in contract microelectronics manufacturing, and experience selling to the medical and component industries are preferred. A 4 year business or engineering degree is desired.
Creative-Leadership, Inc., Position Code D124, 11777 Bernardo Plaza Court, Suite 101, San Diego, CA 92128, email: resumes@clci.com, Fax: (858) 592-0413.

SEMICONDUCTOR PACKAGING ENGINEER - NEC Electronics, a leading U.S. semiconductor supplier, has an immediate opening for a senior level Packaging Engineer. You will be responsible for developing new packaging based on new customer projects. Qualify the subcontractors for packaging assembly and raw material suppliers. Developnew substrate and raw material to improve the packaging reliability performance. New package design and development to support market requirements. Create new packaging characteristic data like electrical and thermal data. Technical meeting with customers for the new packaging development. BS or MS degree. 5+ years experience in packaging R&D. 3+ years in semiconductor packaging and assembly field. Extensive experience in the supplier (substrate and raw material) qualification and package development. Experience in electrical and thermal characterization. A good understanding of package design rule, detail package structure, and package assembly technology. An understanding of the substrate manufacturing process and technology. Understand how to review the multi layer packaging and design and modify the packaging design if necessary. Good technical communication skills in dealing with customers and suppliers. Efficient in qualifying suppliers for raw materials. The position is located at NEC Electronics headquarters in Santa Clara, California.
Please email (preferred) or fax resumes to the attention of Eve Walton. Email: eve_walton@el.nec.com. Fax: 1-800-972-4565

SENIOR APPLICATIONS ENGINEER - Fiber Position Summary: Serve as technical lead person in team-oriented design process for this Oregon-based company that designs, manufactures and tests Advanced Packaging Solutions to include MCMs, Hybrids and High Density Packages. Needs to be fully focused on future industry trends while dramatically influencing reduction of product development cycle. Job responsibilities: Analyze incoming technical specifications to fit organization's capabilities, act as "front person" in dealings with customers regarding engineering design process, add value by working in concert with engineering to design "build to print" products, assist in fostering a team environment, assist in determining employer's technology requirements for current and future products, complete technical proposals and perform cost analysis for quotations, work closely with business development function to effectively serve customer base. Candidate Profile: Technical degree, MS or Ph.D. preferred, 10-15 years experience in field of fiber optics, (data or telecommunications preferred), well connected in their respected industry, substantial "design in process" experience, detailed knowledge of module technology, ability to listen and precisely understand customer requirements and communicate/translate those needs to colleagues, ability to assertively present and defend ideas, ability to assume team leadership, ability to influence time to market of current and future products.
Interested candidates, please contact Jerry Calavan at Woodworth International at (503) 225-5000 or jcalavan@woodworth.com

SENIOR THERMAL PACKAGING ENGINEER - Mercury Computer Systems located in Chelmsford, Massachusetts, is the leading independent producer of high-performance digital signal and image processing computer systems that transform sensor data to information for analysis and interpretation on a real-time basis. We currently have an opportunity in our Manufacturing Department for a Senior Thermal Packaging Engineer. Responsibilities: Logistic development and application of advanced thermal packaging to board level products. Investigate and apply appropriate advanced thermal management packaging techniques to support state-of-the-art digital signal processing (DSP) based electronic systems. Work closely with hardware engineering to develop manufacturable PWB/PWA solutions. Perform thermal analysis, present findings and make recommendations to design. Qualified candidates will possess a BS in a physical science. Experience in sophisticated electronic packaging. Working knowledge of PWB construction and associated material/processes. Proven ability to manage sophisticated products from design concept, through development/testing/qualification, and into full release to production. For additional company information, please see our website at www.mc.com
Please send resumes to: cmathieu@mc.com

TECHNICAL SALES REPRESENTATIVE - Cytec Fiberite, Inc., the global leader in advanced composites and adhesives materials has an opening for a Technical Sales Representative to support our Cybond electronic products. This position is based in Cytec Fiberite's headquarters in Tempe, Arizona. The selected candidate will be responsible for managing the sales function for Cybond electronic products in the West Coast, establish account strategies, annual sales and business development objectives, develop plans for maintaining and developing new business with excisting customers and targeted new accounts. This position requires a self-driven professional who is familiar with the electronics, materials, or adhesives industry and is sensitive to customer needs and activities. Must have a BS Degree in Engineering or related field and 4-6 years of experience in sales. Must be willing to travel. Cytec Fiberite rewards your ambition with a comprehensive salary and benefits package.
Please fax your resume to Employee Resources, Dept. TSR at 602-730-2140. EOE. Visit www.cytec.com

TEST ENGINEER - The candidate selected will provide development and design of new product features. Will design, analyze and troubleshoot analog and digital circuitry and will propose and implement countermeasures to ensure quality and reliability. Will confirm the design status of new models as necessary. Will also program ICs using assembly language, C, or C++. Will work closely with production departments. The selected candidate will have a BS, EE and a minimum of 6 months experience (intern or co-op) working with electrical circuits. Must be able to work in a team environment. Must be able to work in the US on a permanent basis. Positions have sign-on bonus, relocation, full benefits, 1 month vacation/personal time in first year. 401K & profit sharing, major discounts on consumer products.
Please email your resume to me in a Word format to bkelly@hoskinshains.com

VICE PRESIDENT OF SALES, MARKETING OR BUSINESS DEVELOPMENT - Executive experience with specialty electronic materials and microelectronic packages. Successful track record in developing new business, leading an international sales force and running a unionized manufacturing operation. Advanced degree in Materials Science plus top-tier MBA.
Please contact Jim Synk, Ph: 212-517-7993, E-mail: jimsynk@aol.com

VP OPERATIONS - Our company has sales of nearly $400 million and manufactures highly engineered electronic components and sub systems for the telecommunications industry. We are in need of an experienced operations VP to oversee both domestic and international plant facilities employing 5,000+ employees. A successful candidate must have multi-plant experience in a related industry and have the breadth of experience to implement MRP II, cellular manufacturing, etc. Experience as a GM would also be a definite plus. Salary $150-175 range, plus bonus, etc.
Please fax resume and most recent compensation to Ken at 414-335-0625.

 

hot_news.gif (7666 bytes)

Your browser is not Java capable or Java has been disabled.



Back

barpack.gif (2730 bytes)

Top of Page

 

[ Home ] [ IMAPS 2000 ] [ Chapters ] [ Calendar ] [ Publications ] [ Membership ]
[ Virtual Trade Show ] [ Call For Papers ] [
Advanced Educational Opportunities ]
[ Microelectronics Marketing Research Council ] [ Ceramic Interconnect Initiative ]
[ IMAPS Educational Foundation ] [ Discussion Boards ] [ Market Place ] [ Search]
[ IMAPS Web FAQ  ] [ Leadership ] [ Press Room ] [ Advertising ] [ Contact IMAPS ]

 

IMAPS-International Microelectronics and Packaging Society
1850 Centennial Park Drive, Suite 105, Reston, VA 20191-1517
Phone: 888-464-6277 or 703-758-1060; Fax: 703-758-1066
The Microelectronics And Packaging Society

IMAPS Web Site Privacy Statement
1997-1999 IMAPS