Make your own free website on Tripod.com


IMAPS 2000 International Symposium & Exhibition
Chapter Profiles
Call for Papers
Advanced Educational Opportunities
Employment Opportunities Marketplace
IMAPS Educational Foundation
Microelectronics Marketing Research Council
IMAPS Ceramic Interconnection Initiative
Discussion Boards
IMAPS National Leadership
Press Room
Advertising Opportunities
Contact IMAPS
Site Search
IMAPS FAQ



The International Microelectronics And Packaging Society (IMAPS) is a society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the promotion of the Society’s portfolio of technologies.

 Founded in 1967 IMAPS is a leading international microelectronics and electronic packaging society with professional members in 24 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals.  IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.

 In 1996, the original Society, ISHM, merged with the International Electronic and Packaging Society (IEPS) to become IMAPS (International Microelectronics And Packaging Society), the leading international microelectronics and electronic packaging organization. With this immense growth, the Society now hosts over 30 meetings worldwide and the annual microelectronics symposium attracts more than 6,000 of the world’s premier scientists and engineers in microelectronics and packaging.

MEMBERSHIP:
Domestic – 7,000 International – 4,000

CORE TECHNOLOGIES:

High Density Packaging

Materials

Automotive Electronics

System Level Packaging

Chip Scale Packaging

Optoelectronics

Power Packaging

Sensors

Flat Panel Displays

Surface Mount

Flip Chip

Thick & Thin Film

PWB Integrated Passives
 Flex Crcuits Microwave

Thermal Management

Interconnections






 

 

 

 

hot_news.gif (7666 bytes)

Your browser is not Java capable or Java has been disabled.



Back

barpack.gif (2730 bytes)

Top of Page

 

[ Home ] [ IMAPS 2000 ] [ Chapters ] [ Calendar ] [ Publications ] [ Membership ]
[ Virtual Trade Show ] [ Call For Papers ] [
Advanced Educational Opportunities ]
[ Microelectronics Marketing Research Council ] [ Ceramic Interconnect Initiative ]
[ IMAPS Educational Foundation ] [ Discussion Boards ] [ Market Place ] [ Search]
[ IMAPS Web FAQ  ] [ Leadership ] [ Press Room ] [ Advertising ] [ Contact IMAPS ]

 

IMAPS-International Microelectronics and Packaging Society
1850 Centennial Park Drive, Suite 105, Reston, VA 20191-1517
Phone: 888-464-6277 or 703-758-1060; Fax: 703-758-1066
The Microelectronics And Packaging Society

IMAPS Web Site Privacy Statement
1997-1999 IMAPS