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Technical Publications
Multichip Module Technology Handbook
Philip E. Garrou & Iwona Turlik
ISBN: 0-07-022894-9
Member: $100 Nonmember: $150
Overseas Shipping & Handling: $15
MCMs are increasingly in the mainstream of electronics design due to both their
falling prices and increasing demands for speed and performance. This handbook will serve
as the standard MCM reference for the electronics industry. It provides complete guidance
on how to design, manufacture, assemble, test, and inspect the MCMs of today and
tomorrow.The handbook focuses on the application of MCMs to industry design problems
including analysis of the pros and cons of ceramic, deposited, and laminate MCMs. Other
key topics include tech drivers, MCM electrical performance, large area processing, 3D
packaging, module-to-board interconnection, high clock rate systems, known good die (KGD),
and thermal issues.
Wire Bonding in Microelectronics Materials, Processes, Reliability
& Yield
George Harman
ISBN: 0-07-032619
Member: $65 - Nonmember: $115
Overseas Shipping & Handling: $15
Get the Practical know-how you need to design and evaluate wire bonds' engineering with
the latest – and still evolving – metallurgies. Extensively revised and updated,
the Second Edition of George Harman’s classic book on wire bonding shows you
step-by-step how to exploit new higher density interconnection techniques and engineer
reliable bonds at a very high yield. The book offers the hands-on guidance that is needed
to test wire bonds, clean bond pads to improve bondability and reliability, solve other
mechanical problems, bond wires to multichip modules, and much, much, more. The book also
includes up-to-the-minute details on utilizing fine pitch, and applying new bonding
metallurgies, wire sweep, and the wire bonding mechanism.
Thin Film Technology Handbook
Aicha A. R. Riad, Ph.D., Fred D. Barlow & IMAPS
ISBN: 0-07-019025-9
Member: $90 - Nonmember: $140
Overseas Shipping & Handling: $15
The most comprehensive source available on the preparation, characterization, and emerging
applications of this film. This book features extensive new advances applied in multichip
modules, and covers the basic principles and applications of thin film deposition
techniques for pratical use. It provides and develops design guidelines to realize
multilayer structures in microcircuits, thus addressing a critical and rapidly growing
area.
Thermal Management Handbook for Electronic Assemblies
Jerry E. Sergent & Al Krum
Member: $90 - Nonmember: $140
Overseas Shipping & Handling: $15
Electronic systems have shrunk in size far faster than their heat-producing power
supplies, leading to major design and reliability problems. This guide provides
comprehensive information on the thermal management of printed circuit board, hybrid
circuits, and multichip modules, complete with data tables and a bounty of design
examples. Coverage of all thermal management issues in electronic packaging addresses how
to measure thermal properties of different materials, assess heat loss in active devices,
in conductor traces, and at high frequencies, determine temperature at a given point or
region in an electronic assembly, conduct thermal analysis of common configurations found
in electronic assemblies, and cool electronic circuits.
The Handbook of Hybrid Microelectronics
Jerry Sergent and Charles Harper, eds.
ISBN: 0-07-026691-3 ; 800 pp., 400 figs., tables
Member: $90 - Nonmember: $140
Overseas Shipping & Handling: $15
The new edition of The Handbook of Hybrid Microelectronics will provide data, information,
and guidelines to all who design, manufacture, and use hybrid microcircuits, as well as
those who develop and market parts and materials for hybrids. Chapter subjects include an
introduction to the many areas of hybrid microelectronics, substrates for hybrid circuits,
thick film technology, thin film technology, other metallization technologies, circuit
assembly, packaging of hybrid circuits, reliability of hybrid assemblies, failure analysis
of hybrid microcircuits, hybrid facilities, and design procedures for hybrid
microcircuits.
Multichip Module Technologies and Alternatives: The Basics
Daryl Ann Doane and Paul D. Franzon, eds.
ISBN: 0-442-01236-5; 875 pp., 309 figs., 104 tables
Member: $100 - Nonmember: $150
Overseas Shipping & Handling: $20
This book discusses the key decisions needed when considering using MCM technologies from
four perspectives: materials, manufacturing, system performance requirements, and cost
requirements. This book presents the basics of MCM technologies from these four
perspectives with an emphasis on decision making. This applications-oriented book
discusses examples of MCMs and the products and systems where they have been used,
examples of equipment and processes used to design, build and test MCMs. Actual case
studies provided by leading companies including DEC, Unisys and Hughes.
Multichip Module Design, Fabrication, & Testing
James J. Licari
ISBN 0-07-037715-4
Member: $55 - Nonmember: $105
Overseas Shipping & Handling: $15
Written by one of the developers of MCM technology, this book not only describes how
multichip modules work, but also provides a systematic approach to applying them
effectively in the packaging of high-density, high performance electronics. This book
provides complete information on the definition, characteristics and applications of MCMs,
including comparisons with other packaging approaches as well as their relevant
applications.
Multichip Modules & Related Technologies: MCM, TAB, and COB
Design
Gerald L. Ginsberg and Donald P. Schnorr
ISBN 0-07-023552-X
Member: $55 - Nonmember: $105
Overseas Shipping & Handling: $15
This guide will introduce the reader to MCM, TAB and COB design, demonstrating how these
technologies are capable of producing results that are significantly lighter, smaller and
cheaper than conventional packaging methods.
Electronic Materials & Processes Handbook
Charles A. Harper and Ronald M. Sampson
ISBN 0-07-054299-6
Member: $80 - Nonmember: $130
Overseas Shipping & Handling: $20
This handbook offers guidance on insulations, conductors, and semiconductor materials,
defines critical manufacturing parameters, and shows how these parameters can be combined
to create successful electronic devices. In addition, this handbook gives you detailed
information on plastics, elastomers, PWBs, ceramics and glasses, semiconductors, ferrous
and nonferrous metals, wire and cable, thick and thin films, electrodeposition materials
and processes for advanced packaging.
Ball Grid Array Technology
John H. Lau
ISBN 0-07-036608-X
Member: $65 - Nonmember: $115
Overseas Shipping & Handling: $15
This book is a one stop guide to state-of-the-art BGA technology. For professionals active
in BGA research and development, those who wish to master BGA problem solving methods, and
those who must choose a cost effective design and high-yield manufacturing process for
their interconnect systems, this is a timely summary of progress in all aspects of this
field.
Modern Solder Technology for Competitive Electronics
Jennie S. Hwang, Ph.D.
ISBN: 0-07-031749-6
Member: $75 - Nonmember: $125
Overseas Shipping & Handling: $20
With the wide spectrum of expertise on the part of readers, Dr. Hwang has sought to
provide a middle ground in the level of treatment of topics while offering a comprehesive
and complete book which coversall essential elements associated with the applications of
solder material and the soldering processes for electronics and microelectronics packaging
and assembly.
Reference Books from
Electrochemical Publications Ltd.
Now available from IMAPS Publications
All Electrochemical Publications will be shipped from the
United Kingdom via overseas air mail. Therefore, if you are ordering any of these books,
you must add an additional 25% of the total amount of these publications ordered, to your
total price on the Order Form to cover the shipping costs. The EPI books listed in this
section are non-refundable.
Handbook of Printed Circuit Design, Manufacture, Components, &
Assembly
G. Leonida
ISBN 0 901150 09 6
Member: $170- Nonmember: $220
In view of the importance of PCB assembly, it is somewhat surprising that there is a
noticeable dearth of published literature on the subject and although a number of
textbooks are now available on PCB manufacture, little, if any, space has been devoted in
these publications to assembly. The author’s primary aim was to rectify this
situation, with the result that this is the first reference book to treat the subject of
assembly in depth. Furthermore, as all other aspects of printed circuits such as Design,
Components, Quality Control and in particular, Manufacture — the latter being a book
in itself — are covered in considerable detail, this Handbook must rank as one of the
most comprehensive and important reference texts ever to be published in this field.
Printed Circuit Boards for Microelecrtronics (Second Edition)
J. A. Scarlett
ISBN 0 901150 08 8
Member: $110- Nonmember: $160
Printed Circuit Boards for Microelectronics’was the first book written about the
design of printed circuit boards for use with integrated circuits. Since the First Edition
was published in 1970 it has been widely regarded as the standard textbook on the subject.
For this Second Edition the entire text has been thoroughly revised; some portions have
been totally re-written; two new chapters have been added. The author has drawn heavily on
his own experience in running the Design Department of Exacta Circuits Ltd, where complex,
high density boards for almost all the leading companies in the UK electronics industry
have been designed. Consequently, the information given on the design of boards is
applicable to the widest possible range of equipment and also ensures that the design
techniques described result in truly cost-effective boards.
An Introduction to Printed Circuit Board Technology
J. A. Scarlett
ISBN 0 901150 16 9
Member: $85 - Nonmember: $135
The author’s wide experience, covering over 20 years of design, manufacture, and use
of PCBs in computers and complex military equipments, has helped in selecting the
fundamental points which must be included. The text treats the whole field of PCBs from
their history, through electrical and mechanical properties, design, manufacture and
assembly to inspection and testing. The range of boards described includes low and high
density boards, specialised boards for surface mounting and carrying large chip carriers,
and complex flexi-rigid types. The book is written in an easy-to-read style, with minimal
reliance on mathematics to make its points. Technical terms are explained in a
comprehensive glossary. References, most of which are by acknowledged experts in their
fields, have been thoroughly checked out and found to be of real value.
The Multilayer Printed Circuit Board Handbook
Edited by J. A. Scarlett
ISBN 0 901150 15 0
Member: $185 - Nonmember: $235
Although multilayer printed circuit boards have been in use in the electronics industry
since 1961, and have been mentioned in a number of other books, there has been no
definitive work on multilayer boards. This internationally multi-authored Handbook
remedies this omission and provides comprehensive, authoritative guidance on the design,
manufacture and use of what are the most expensive and complex types of PCBs. All the
authors have been selected as being widely recognised as leading authorities in their
particular fields, and many are familiar as speakers at international conferences and
symposia. The subjects covered include a general review of the history and use of
multilayer boards, board types and general manufacture; detailed chapters on all aspects
of manufacture including printing, etching, lay-up, bonding, drilling, smear removal,
plating, finishes, cleaning, testing and inspection; quality, stability, repairs,
soldering and design; with specialist chapters on topics such as radiographic inspection,
flexi-rigid boards, and Multiwire™.
A Guide to the Design and Manufacture of Printed Board Assemblies
(Vols. I & II)
Edited by W. MacLeod Ross
ISBN 0 901150 32 0
Set: Member $325 - Nonmember $375
Per Volume: Member $175 - Nonmember $225
This is the only book to cover in a practical manner all facets of the design and
manufacture of printed board assemblies, from inception to final completion. Because of
the amount of detail provided, it has been found necessary to divide the text into two
volumes, the first covering components, assembly techniques and design, the second
covering manufacture of printed boards of all types, quality assurance, cleaning and the
environment, and marketing and product costing. Volume 1 describes conventional
(pin-in-hole) and surface mounting components and their packages before going on to
discuss manual and automatic methods of assembly in considerable depth. Only then are the
principles of design and layout of circuits set out. The importance of paying careful
attention to thermal management of the design is stressed. The first volume finishes with
a section which comprises five chapters on soldering and joining — almost a book in
itself. Volume 2 begins with a section that describes in a number of separate chapters the
materials and basic methods for fabricating printed boards. The next section in this
volume covers the different types of circuit board and gives their manufacturing outlines.
Contamination control, effluent, environmental problems arising from electronics assembly
and occupational health are the subjects of the chapters in the third section. Section 4
deals with quality assurance, testing and training and education and the volume concludes
with a discussion of marketing and financial matters.
Handbook of Printed Circuit Technologies Volume 2: New Processes,
New Technologies — English language edition
Edited by G. Herrmann & K. Egerer
ISBN 0 901150 26 6
Member $160 - Nonmember $210
Volume 2 has been compiled from contributions by an international team of 20 authors from
Germany, Japan and the USA, drawing together specialised knowledge and expertise in the
new processes and technologies which have emerged in recent years. In addition to a
detailed description of processes, a summary is given of the costs of interconnection
techniques at chip and board level so that comparisons may be drawn. The book shows
printed circuit manufacturers and all those associated with printed circuits where trends
are leading as signal processing speeds continue to increase.
Handbook of Microelectronics Packaging and Interconnection
Technologies
Edited by N. Sinnadurai
ISBN 0 901150 19 3
Member $120 - Nonmember $170
Microelectronics packaging and interconnection technologies have undergone both
evolutionary and revolutionary changes to serve the trend towards miniaturisation in
electronic equipment, which is now very evident in military, telecommunications,
industrial and consumer applications. The trend has been driven by various forces,
including specialist requirements for size and weight as well as cost and aesthetics,
which have led to various innovative developments in packaging of integrated circuits and
in connectivity on electronics substrates and circuit boards.These technologies and their
trends, as well as the driving forces, are described and examined in this book.
Handbook of Thick Film Technology
Edited by P. J. Holmes & R. C. Loasby
ISBN 0 901150 05 3
Member $130 - Nonmember $180
This book on thick film technology has been written by research workers who have been in
everyday contact with electronic equipment designers and production engineers. It aims to
help readers in every branch of the industry towards an understanding of the background
against which the current practices of thick films have grown up, and should form a useful
complement to already-published books which catalogue in detail the production equipment,
materials, components and design principles which are at present in use.
Thick Film Technology and Applications
by M. R. Haskard & K. Pitt Available January, 1997
Member $75 - Nonmember $125
This book is the result of a collaboration between two authors with complementary
expertise in thick-film technology, both in industrial applications and in teaching.
Although a theoretical background is provided where appropriate, the approach concentrates
on the design, manufacture and applications of thick-films. A unique feature of the book
is the presentation of a PC compatible disk with it containing the thick-film CAD program
CAHL (Computer Aided Hybrid Layout), developed at the University of South Australia.
Thermal Design of Electronic Circuit Boards and Packages
by D. J. Dean
ISBN 0 901150 18 5
Member $180 - Nonmember $230
The need for the thermal design of electronic systems is well established but rarely given
the attention it deserves. This is partly attributable to the mystique that has built up
around thermal predictions and the tradition that thermal calculations are only for the
academic mathematician. This book aims to overcome these barriers and enable the
electronic engineer to tackle with confidence his own thermal design. To deal with
thermally caused failures it is necessary to know where the large temperature differences
are and also which of these can be economically reduced. This text concentrates on the
part of electronic systems which generally contributes most to the overall temperature and
is also frequently the most economical to tackle—that neglected area close to the
heat sources, namely the circuit boards and packages. The book presents the
electronic designer with the expertise and a tool kit of temperature prediction methods
with which he will be able to tackle his own particular problems. Mathematics are reduced
to a level where all the formulae can be obtained using a typical programmable pocket
calculator.
Soldering in Electronics—Second Edition A Comprehensive
Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques
by R. J. Klein Wassink
ISBN 0 901150 24 X
Member $200 - Nonmember $250
The book provides a combination of background knowledge and information for practice. In
doing so it helps to clarify many points of basic discussion among soldering experts, such
as wetting and dewetting, thermal influences, solderability and methods of its assessment,
metallurgy of alloys and coatings, and process conditions. On the other hand it contains a
wealth of detailed and practical information on soldering alloys, fluxes, coatings,
soldering methods, pattern design, joint reliability and criteria for joint inspection. A
separate chapter is devoted to the thermal aspects of soldering, a subject that is seldom
discussed in literature despite its utmost importance for soldering. In the second
edition, extensive attention is given to surface mounting technology, with subjects like
component metallisations, dimension of footprints of leadless and multi-lead packages,
application of solder paste and adhesive, adapted wave soldering and reflow soldering
techniques, such as infra-red soldering, vapour phase soldering, resistance soldering and
laser soldering.
Manufacturing Techniques for Surface Mounted Assemblies
R. J. Klein Wassink & M. M. F. Verguld
ISBN 0 901150 30 4
Member $200 - Nonmember $250
This book intends to provide practical information, but related to background knowledge
and understanding. The authors hope that the understanding provided will be of
long-lasting significance to readers. The book starts with a chapter identifying changes
and trends in surface mounting. Components and boards, including flexible substrates, are
treated as far as this is useful for the following chapters. The manufacturing flow line
for surface mounted assemblies (process integration) forms a central theme in the material
discussed. Details of such a line are dealt with at length. A full chapter is devoted to
processes for microelectronics (chip on board, connection of foils, etc.), including wire
bonding, TAB and adhesive bonding. Ample attention is given to laser
soldering.Considerable attention is paid to the principles of process control, with an
elucidation of reflow soldering. Information is given on compositions, cracking of joints
and solderability assessment, etc., with special attention devoted to the matter of
lead-free solders. With regard to fluxes and their environmental effects, methods of
reducing the amount of flux are evaluated, with special attention to inert gas soldering,
for both wave soldering and reflow soldering. The issue of cleaning (or not cleaning) is
considered, in relation to the present environmental requirements.
A Scientific Guide to Surface Mount Technology
C. Lea
ISBN 0 901150 22 3
Member $185 - Nonmember $235
The purpose of this book is to give the reader a better scientific understanding of the
physical mechanisms involved in the implementation of this novel technology. The aim is
that, through a scientific perception, both the manufacturing efficiency and the product
reliability will benefit from the revolutionary step of surface mounting, in offering the
electronic assembly industry solutions to the new problems that are firmly based,
technically and scientifically. This book presents a full and rationalised coverage of all
the major aspects of surface mounting technology, giving the underlying principles
involved which in turn offer guidelines for design, assembly, inspection and test. The
scientific underpinning of SMT is illustrated using existing components, substrates and
soldering techniques, but in a format such that the guidelines can be readily extended for
continued use as the technology inevitably progresses.
Surface Mounted Assemblies
J. F. Pawling
ISBN 0 901150 21 5
Member $115 - Nonmember $165
This book has been written by a team of industrial-based engineers, technologists and
scientists, each of whom is an expert in his own field, who combine theory with many years
of practical experience. The objective of the authors has been to provide a logical, full,
and yet concise, coverage of all the major aspects of the application of surface mounted
technology. It is hoped that, while emphasising the practical aspects for the benefit of
those already working in industry, it will be a useful introduction for those studying to
become professionally qualified. References and/or a bibliography are provided at the end
of each chapter to enable the reader to further extend and deepen his understanding on
specific aspects of the subject.
Setting Up In-House Surface Mount Technology Practical Management
& Technical Guidelines
David Boswell
ISBN 0 901150 28 2
Member $140 - Nonmember $190
This book has a bias towards the needs of small and medium-sized companies aspiring to
introduce or set-up a surface mount facility. The ‘make or buy’ decision is
reviewed, but it is then assumed that this was taken in favour of an in house facility
i.e., the design and production of surface mount and mixed technology assemblies. The aim
is to help managing directors and department heads in design, purchasing, production,
quality, personnel and finance, in companies setting up a new line or running an existing
operation. The content is structured in two sections. It moves the reader step by step
through each stage, first in the planning and then in the implementation of a facility.
There is a strong emphasis on practical details and pitfall avoidance.
Ball Grid Array and Fine Pitch Peripheral Interconnections A
Handbook of Technology & Applications for Microelectronics/Electronics Manufacturing
Jennie S. Hwang
ISBN 0 901150 29 0
Member $140 - Nonmember $190
This handbook, dedicated to the interconnection of both array and peripheral IC packages,
covers all important aspects related to these packages and their interconnection to the
motherboard. It includes material characteristics, assembly processes, package types,
inspection/rework and commonly occurring defects and remedies on the production floor. The
key factors related to the reliability of solder interconnections and common failure modes
are discussed.The book highlights the contrast and comparison between these two packages
in technology and applications. The information is laid out in a concise fashion and
provides readers with quick access to specific areas of interest.
Cleaning and Comtamination of Electronics Components and Assemblies
B. N. Ellis
ISBN 0 901150 20 7
Member $150 - Nonmember $200
This book is a practical guide for all persons who are in any way concerned with cleaning
or contamination control of either components or assembled circuits. It is also useful to
those specifying components and, in particular, printed circuits. It equally covers the
theoretical side to a sufficient extent to allow the average engineer or technician who is
not a specialist in the field to understand the mechanisms involved in contamination and
cleaning. As a reference book, the text is divided into seven parts, logically divided
into some thirty chapters illustrated by photographs, line drawings, graphs and tables.
Each chapter has its own reference list. It is felt that this book will become a valuable
reference work for the bookshelves of all companies involved in any aspect of electronics,
particularly component, printed or hybrid circuit manufacturers or assemblers.
After CFCS? Options for Cleaning Electronics Assemblies
C. Lea
ISBN 0 901150 25 8
Member $180 - Nonmember $230
High reliability electronics assemblies are cleaned to remove flux residues that prevent
automatic electrical testing and also present a potential service reliability hazard. The
great majority are cleaned using CFC-113. Many are cleaned using 1.1.1 trichloroethane.
The electronics assembly industry is therefore faced with an urgent problem. It needs to
find alternatives for these solvents. This book describes the options available to the
electronics assembly industry to address this problem. The scene is first set with an
explanation of the mechanisms of ozone depletion and its threat to life on the planet
Earth, followed by an account of the fascinating struggle towards an acceptance of
worldwide regulatory control of such ubiquitous chemicals as CFCs then follows a brief
look at how other industrial sectors are coping with the onset of life without CFCs.
Handbook of Aqueous Cleaning Technology for Electronic Assemblies
F. R. Cala & A. E. Winston
ISBN 0 901150 31 2
Member $140 - Nonmember $190
This book explores all aspects of aqueous cleaning including the chemistry of aqueous
saponifiers, performance, equipment used, measurement, waste treatment needed, safety and
environmental issues relating to the selection and effective use of aqueous cleaning
systems to deflux and clean electronic circuit board assemblies. Its emphasis is on the
practical, while giving a clear presentation of the underlying principles. Readers will be
able to gauge their understanding of the key chapters by working through challenging
problems taken from real life situations and then referring to the solutions given. This
book covers current aqueous cleaning technology but suggests ways to plan for future
developments when installing and starting up an aqueous cleaning process now. Insight is
given as to where the industry, cleaning requirements and regulations are headed.
Gold Plating Technology
Edited by F. H. Reid and W. Goldie
ISBN 0 901150 02 9
Member $180 - Nonmember $230
The contributors’ credits for this, the first comprehensive volume on gold plating,
reads like a “Who’s Who” of precious metal deposition. Anyone who has had
to search through the literature to find data on solderability, for example, a very
important aspect connected with gold plating, will appreciate the convenience of having it
available in one volume where, if what is included does not meet his total need for
information, it at least directs him to the sources of more. This alone makes the book a
very worthwhile investment. And, the ideas which present themselves in the chapters on
applications could suggest further uses offering the possibility of significant economies.
When dealing with a metal as costly as gold these days, it may take only a little pointer
to open the way to save thousands of dollars.
Tin and Tin-Alloy Plating
J. W. Price
ISBN 0 901150 12 6
Member $115 - Nonmember $165
The title of this book has been chosen deliberately. In it the reader will find little or
no electrochemistry and no discussion of the theory of alloy plating. He will, however,
find detailed accounts of the installation, operation and control of the processes now in
commercial use, together with briefer accounts of some of the more promising alternative
solutions which have been proposed, but which have not, so far, achieved industrial
importance. Details of solutions used for the chemical and electrochemical production of
tin coatings and of brush plating are included. The book concludes with a useful summary
of current specifications for plated coatings of tin and tin alloys.
Thickness Testing of Electroplated and Related Coatings
G. P. Ray
ISBN 0 901150 27 4
Member $100 - Nonmember $150
The purpose of this book is to describe the methods which can be used to measure the
thickness of electrodeposited and ‘electroless’ (autocatalytic) coatings on both
metallic and non-metallic substrates, conversion and hot-dipped coatings on metallic
substrates, vitreous enamel coatings on metals, anodic coatings on aluminium and other
metals and chemical replacement coatings on metallic substrates. Many of the methods,
especially some of those based on non-destructive techniques, are equally applicable to
organic coatings deposited on metallic substrates. The book attempts to give sufficient
details of the test methods for them to be carried out without reference to any of the
literature, apart from the instruction supplied by the instrument manufacturers for their
particular instruments.
Metallic Coating of Plastics (Vols. 1 & 2)
W. Goldie
Set: Member $110 - Nonmember $160
Volume I (photocopy): Member $40 - Nonmember $90
Volume II: Member $80 - Nonmember $130
This book describes procedures and processes used in the metallic coating of plastics
as a first stage in the production of an electroplated deposit. Techniques for depositing
the initial conducting film by electroless techniques prior to electroplating and the
pretreatment of the individual plastics themselves, are dealt with in considerable detail.
In addition, the equipment used for electroplating, analysis and control of the solution,
testing of the deposits and component design are discussed in some depth. The author
recognises that methods other than electroless deposition exist whereby metallic deposits
can be obtained on plastics. A serious attempt has therefore been made to highlight the
essentials of these processes.
Handbook of Electronic Connectors
Edited by P. Antony Clayton
ISBN 0 901150 11 8
Member: $140 - Nonmember: $190
To the best of the Publisher’s knowledge, this book is not only the first, but the
only text book currently available which is devoted solely to the subject of Electronic
Connectors. This is a first class handbook that will undoubtedly be the definitive
reference work on this subject. Which will be of immense value to all those concerned,
however remotely, with the design, use or manufacture of electronic connectors.
Material Processing with ND-Lasers
C. J. Nonhof
ISBN 0 901150 23 1
Member: $140 - Nonmember: $190
This book is devoted to material processing with Nd-lasers. Its scope covers the totality
of material processing from the tool to the material. The laser resonator and attached
optical systems are discussed in Chapters 2 and 3 on the basis of the two optical theories
used. Laser systems and measurements to check their performance are discussed in Chapter
4. With sufficient knowledge of the tool one may start material processing, which is
discussed in Chapters 5 to 7. The introductory Chapter 1 is used to give the reader
reasons to consider Nd-lasers for material processing and to start the study of the more
detailed Chapters 2 to 7. The purpose of the book is to provide the necessary background
knowledge for working with Nd-lasers. It is very unfortunate that, in order to deal with
all the problems, one has to go into such great depth on a large range of disciplines.
Subjects such as laser physics, optics, interaction of light with matter, hydro-dynamics,
physics of welding, heat flow and metallurgy are dealt with. It is of the utmost
importance to find a balance of knowledge between the various subjects.
Thermal Modeling & Optimisation of Power Microcircuits
A. Kos & G. DeMay
ISBN: 0 9001150 36 3
Member: $90 - Nonmember: $140
In this book the authors have proposed several methods for solving the heat transfer
problem in microelectronics in both the classical and unconventional ways. New techniques
applying artificial neural networks have been introduced. The algorithms and methods
outlined have been worked out for hybrid circuits. However, most of the techniques can be
used for other applications also. Several methods described in the books have been used
for the thermal design of monolithic GaAs circuits, PCBs, VLSI circuits and heating
elements.
Multilayer Bonding Guide
M. Huschka
ISBN: 1 872422 00 4
Member: $90 Nonmember: $140
The detailed information and guidance to those involved in the growth area of multilayer
manufacture in this book provides manufacturers with expertise they need concerning the
options open to them and comparisons of the various methods employed. Chapters focus on
Multilayer Construction, Bonding Preparations, Lay-up of Multilayer Stacks, Multilayer
Presses, Press Cycles, Multilayer Trouble Shooting, and Test Methods.
Surface Mount & Mixed Technology PCB Design Guidelines
David Boswell
ISBN: 1 872422 01 2
Member Price: $150 - Nonmember: $200
This handbook contains the vast array of information required for successful design for
manufacture in the new SM interconnection medium. The data steers the design engineer
through the many and often conflicting requirements, offering not only advice but the
considerations which lie behind that advice. Seventeen clearly subdivided sections cover
the wide span of factors requiring attention. Comprehensive sections on testing,
inspection, rework, and final stages compete this clear and thorough presentation.
Electroplating
Frederick A. Lowenheim
ISBN: 1 872422 03 9
Member: $120- -Nonmember: $170
This book gives you a comprehensive basic understanding of the materials and processes of
electroplating. It examines the influence of metallurgy and corrosion in electroplating,
then describes preplating procedures with emphasis on the chemical considerations. A
distinctive feature of this book is the detailed discussion of plating metals. Each metal
is examined in terms of its abundance and origin, its place in the periodic system,
methods of recovery, physical and chemical properties, principal compounds and their
reactions. The actual plating processes are described along with recommended practices.
Sponsored by the American Electroplaters’ Society, this book fills a need for
authoritative, comprehensive introduction to the theory and practice of electroplating.
BGA, COB, & Flip Chip PCB Design
James C. Blakenhorn
Member: $180 - Nonmember: $230
New products are pushing density and speed to the limits. To support this evolution,
packaging technologies are moving at a rapid pace. Designers are trying to keep up and
find information that can help in implementing these new technologies. This book was
written to provide such help. There is also alot of information on how to make land
patterns, determine the number of layers needed optimizing placement, evaulating the
routing, via placements, setting up PCB specs and lots more. The many issues needed to
understand BGA are addressed in this book.
High Speed PCB Design
Lee W. Ritchey & James C. Blankenhorn
Member: $300 - Nonmember: $350
To understand the high speed problems that faster circuitry is causing, this book covers
topics including tranmission line principles and operation, routing and interconnecting,
line width affects, trace spacing effects on coupling decoupling, planes, sequencing,
propagation delays, stubs, terminators, and controlling noise. Also included is a new
workbook section that hleps you to apply the information covered and put it into a
meaningful and useful format.
Practical Implementation & The Theory of Testing SMT
Robert Hanson
Member: $150 - Nonmember: $200
This book discusses the impact of good test with surface mount designs along with defining
and describing methods of simulation in order to assure that ASICs or other complex
devices have the highest probability of working the first time. One of the main purposes
of this books is to give a set of rules for achieving perfect barebaoard and in-circuit
test.
Mastering & Implementing BGA Technology
Member: $150 - Nonmember: $200
Overseas Shipping & Handling: $30
A publication from Advanced Electronics Interconnect Center, this practical handbook makes
it easy to understand and apply BGA technology to your product. It is a must for engineers
and managers in design and packaging of next generation technology, manufacturing
personnel involved with implementing new technology, quality engineering personnel,
contract manufacturers, and material and equipment suppliers.
Directories
Directory of IMAPS Members
Approximately 6,000 individual and corporate members. Available in electronic or label
form.
Corporate Members: First Set Free, Additional Sets $75 per 1,000 Names.
Nonmembers: $75 per 1,000 Names plus $330 Administrative Fee.
One year regular membership included in nonmember cost.
Overseas Shipping & Handling: $10
1996 --1997 Worldwide MCM & BGA Industry Directory
Member: $300 - Nonmember: $350
Overseas Shipping & Handling: $30
A TechSearch International Publication, this directory lists the only up-to-date
compilation of finished module and substrate suppliers, MCM design houses, CAD tool
vendors, base substrate suppliers, thin film dielectric materials, contract assembly
services, bare die sources, chip-on-tape suppliers, bonding assembly and equipment,
testing and inspection services and equipment, and selected academic and research
organizations, with new BGA information.
Abstracts From IMAPS Advanced Technology Workshops
Chip Scale Packaging
MCM Applications & Test
Next Generation Packaging
Flip Chip Technology
Sensor Technology
Integrated Passives
Thermal Spreaders & Heatsinks
$30 per booklet-limited printings
USA Shipping & Handling: $7
Overseas Shipping & Handling: $10
Proceedings
IMAPS Proceedings CD-ROM
Members: $50 - Nonmembers: $100
Overseas Shipping & Handling: CD-ROM: $10
Each year the Society showcase event is the annual Symposium. The Proceedings is a
comprehensive record of the technical program offered at the Symposium. Whether or not you
are attending the Symposium, you wont want to be without your copy of the annual
Proceedings to stay on top of the latest developments in hybrid microelectronics.
MCM '97 & 98 Proceedings on CD-ROM
$30
Overseas Shipping & Handling: $10
MCM '98 (Book Format)
$100 (available in April '98)
Overseas Shipping & Handling: $25
For the fourth year, IMAPS and IEPS have organized the Multichip Module event in the
industry. The Proceedings is a comprehensive record of the technical program offered at
the Conference. Regardless of whether or not you attend the Conference, the Proceedings
will allow you to keep abreast of the latest developments in MCM technology.
Previous Years Available: 1993 and 1994.
International Systems Packaging Symposium, '97 Book Format & CD
ROM:
Member: $100 - Nonmember: $150
Overseas Shippng & Handling: $25
The former IEPS annual meeting will be held in San Diego in Dec., 1997. The proceedings
contain all of the papers presented.
Wireless Communications Conference
Member: $55 - Nonmember: $110
Overseas Shippng & Handling: $15
The Second Annual Wireless Communications Conference was held in Boulder, CO, in August,
1997. Due to the overwhelming demand for both papers and attendance, this one time ATW is
now an IMAPS Annual Conference. The Proceedings offer 49 presentations plus the full
Conference program. A limited number of the 1996 WCC Proceedings is also available.
Japanese Proceedings
Member: $50 - Nonmember: $100
Overseas Shippng & Handling: $15
IMC ’97- Papers from the International Microelectronics Conference held in April 1997
in Omiya Sonic City, Japan. Paper topics include Interconnections, VLSI Packaging, Thin
Film, Thick Film, Substrates, Reliability, MCMs, and Optoelectronics. A limited number of
the 1996 IMC Proceedings is available.
Emerging Microelectronics & Interconnection Technologies -
Bangalore, India, February, 1998
Member: $200 - Nonmember: $250
Overseas Shippng & Handling: $25
More than 100 papers were presented at the second Conference in India where much of the
future of the microelectronics business will be conducted for the benefit of developing
countries. No other democratic country has more potential than India.
Index of ISHM-IMAPS Proceedings 1967-1997 - CD-ROM Member:
$80 - Nonmember: $130
Overseas Shippng & Handling: $15
A new user-searchable cross-platform database CD-ROM containing abstracts and records
corresponding to all of the papers fromm all of the ISHM Sypmposium Proceedings from 1967
- 1997.
Air Cooling Technology for Electronic Equipment
Sung Jin Kim & Sang Woo Lee, eds.
Member: $70 - Nonmember: $120
Overseas Shipping & Handling: $15
Cooling technology has been a vital prerequisite for the rapid growth of the electronic
equipment industry. This has been especially true for the past 15 years with the advent of
integrated circuit chips and their applications in computers and related electronic
products. Questions frequently raised by thermal engineers and packaging practitioners are
addressed in detail with six chapters of the book devoted to answering them
systematically. In addition, the most recent information on air cooling technologies is
also included. This book represents the latest development in cooling technologies and
thermal design guides with air cooling as a medium.
High Temperature Electronics
Patrick McCluskey, Richard Grzybowski, & Thomas Podlesak, eds.
Member: $65 - Nonmember: $115
Overseas Shipping & Handling: $15
This book takes a scientific approach to analyzing and addressing the issues involved in
high temperature electronics, which include designing and specifying components,
developing packaging techniques, designing for particular applications, and testing the
final system. It is a valuable design guide and handbook for engineering, manufacturing,
and science professionals, as well as a tailored resource for graduate, undergraduate,
community college and continuing education.
Asian Electronics
The Korean Electronics Industry, The Singapore & Malaysia Electronics Industry, and
The Taiwan Electronics Industry (The Electronics Industry Research Series)
Michael Pecht, J.B. Bernstein, Damion Searls, M. Pecerar
Member Price (per book): $40 Nonmember: $90
Member Price - 3 Volume Set: $100 Nonmember: $150
Overseas Shipping & Handling: $10 per book or $25 for set
Based on research conducted at the University of Maryland's CALCE Electronic Packaging
Research Center, these volumes will provide the global perspective needed to form joint
ventures or strategic alliances with Asian companies, or formulate strategies to compete
in the fast paced world of the Asian electronics industry. Until now there have been no
books that sought to examine in any depth the phenomenal growth in this part of the world.
These books provide a resource for government policy-makers, industry leaders, and
academics seeking to understand the structure of these countries that has enabled such
CARTS Publications
IMAPS is pleased to make available the publications of the Capacitor and Resistor
Technology Symposia.
Overseas Shipping & Handling for all CARTS Publications: $20
Please specify the year you are ordering:
CARTS USA '96 & '97 $90
CARTS USA '92-'95 $80
CARTS USA '89-'91 $50
CARTS USA '81-'88 $40
CARTS EUROPE '96 & '97 $90
CARTS EUROPE '92-'95 $80
CARTS EUROPE '87-'91 $50
CARTS ASIA '91 $40
Index of all CARTS papers $35
Selection & Applications of Capacitors $70
J. Moynihan (1987)
Theory, Design, & Applications of Electrolytic Capacitors 1982 Or 1983 $50
Components Engineering & Reliability Handbook $80
Capacitor Tests & Measurements Seminar, 1994 $50
Practical Failure Analysis, 1993 $60
Glossary of Failure Analysis Terms & Procedures $65
Seminar 1 – Selection & Application of Capacitors, 1996 $70
Seminar 2 – Reliability & Failure Analysis of Passive Components, 1996 $70
Raw Materials Markets for Worldwide Capacitor & Resistor Industries $1,875
Capacitor & Resistor Worldwide Markets (includes Ceramic Capacitor Worldwide
Markets & Fixed Resistors Worldwide Markets – below) $3,750
Ceramic Capacitors Worldwide Markets, 1996 $2,250
Solid Tantalum Capacitors Worldwide Markets, 1996 $1,875
DC Film Capacitors Worldwide Markets, 1996 $1,250
Fixed Resistors Worldwide Markets, 1996 $1,250
Aluminum Electrolytics, 1996 $1,250
Periodicals
Advancing Microelectronics
Member: Free - Nonmember Subscription: $50
Advancing Microelectronics is the Societys bimonthly information source. Each issue
is packed with information about what is going on in microelectronics; from valuable
technical articles about the cutting edge of microelectronics/MCM technology, to the
latest product and industry developments. The magazine also features the Market Place, an
employment section full of position-wanted and available listings.
In addition, Advancing Microelectronics provides information about IMAPS - from
individual chapter vendor nights to the International Symposium on Microelectronics.
Everything you need to know about the industry and IMAPS can be found in Advancing
Microelectronics.
International Journal on Microcircuits and Electronic Packaging
Member: Free - Nonmember Subscription: Domestic $100 - International $115
The International Journal on Microcircuits and Electronic Packaging is IMAPSs
archival quarterly publication. Each issue contains original, refereed papers from the
leaders in the field of microelectronics and related areas. The final issue of the year
also contains an annual index. Starting July 1, 1999, theJournal will be published on
CD-ROM. A paper copy subscription can be purchased for an additional $10.
Annual Industry Guide
Member: 1st copy free, additional copies @ $40 - Nonmember: $40
Overseas Shippng & Handling: $15
The annual IMAPS Industry Guide has become the source book for information about
microelectronics. The Industry Guide is a comprehensive buyers guide for the
microelectronics industry. This cross-indexed source book is one of IMAPSs most requested
publications. It is a microelectronics marketplace. It also includes the IMAPS membership
directory. The 2000 Industry Guide will be available on-line only.
Special Presentations
The following are transcripts of Executive Forums conducted and
transcribed by Don Brown Associates, Inc.
The Economics of Buried Passive Component Technologies -- A Verbatim
Transcript and Summary
$325
Part of the IMAPS ATW on Passive Component Technology held in March, 1996, Braselton, GA,
this transcript is a "best effort" of the conversations recorded at the Forum.
Every effort has been made to accurately represent the words that were spoken. Many of
those who attended requested that this transcript be made available.
The Future Economics of Electronic Packaging
$325
Sponsored by the IMAPS/MMRC as part of the MMRC meeting Napa Valley, CA, June, 1996.
The Future Economics of Wireless Packaging
$450
Sponsored by IEPS at the IEPS Annual Conference, Austin, TX, October, 1996.
ATAC Reports
Microelectronics Markets in Europe
MMRC Member: $449
Nonmember: $549
ATAC presents recently completed analyses of the European microelectronics market,
projected to 1998. Included is data on the following markets: electronic equipment,
equipment markets by application sectors, semiconductors, total market for hybrid
circuits, the probable hierarchy of current thick film markets and thick film hybrid
growth rates, and the technology distribution of the European Hybrid Microelectronics
Market. For an addtional $80, you can receive worldwide data.
Plastic Packaging for High Reliability
$3,000
This detailed report deals with the materials, assembly, reliability approaches, solutions
for the move from hermetic to plastic, and the actions in hand to adopt the best practice.
The report is of major interest, providing data that indicates that plastic packaging can
provide a higher reliability in severe climates than MIL hermetic packages.
