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Call for Papers

Abstract Deadline: September 1, 1999

International Symposium on Advanced Packaging Materials:
Processing, Properties and Interfaces

March 6-8, 2000
Chateau Elan
Braselton, Georgia

Sponsored by
IMAPS - International Microelectronics And Packaging Society
IEEE Components, Packaging and Manufacturing Technology Society
Packaging Research Center (PRC), Georgia Institute of Technology

Other Participating Societies
American Society of Metals
The American Ceramic Society
Society of Plastic Engineers
Materials Research Society

General Chair:
C.P. Wong, Ph.D., Georgia Institute of Technology
P: 404-894-8391; F: 404-894-9140

Technical Program Co-chairs:
Prof. James E. Morris, SUNY Binghamton
P: 607-777-4774; 607-777-4464

Philip Garrou, Ph.D., Ph.D., Dow Chemical Company P: 919-248-9261; F: 919-248-9265

Tentative Sessions on:
Bumping Materials & Processing
Chip Scale Packaging Materials
Integral Passive Materials
Interfacial Adhesion
Materials Process Control
Mechanics of Materials
Microwave Materials
On-chip Interconnect Materials
High Density Substrates
Thermal Management Materials
Underfills & Encapsulant Materials
Wafer Level CSP

To submit an Abstract please send your 200 word abstract by September 1, 1999 to:

Materials 2K
c/o IMAPS Program Management
1850 Centennial Park Drive
Suite 105
Reston, VA 20191-1517
Fax: 703-758-1066

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IMAPS-International Microelectronics and Packaging Society
1850 Centennial Park Drive, Suite 105, Reston, VA 20191-1517
Phone: 888-464-6277 or 703-758-1060; Fax: 703-758-1066
The Microelectronics And Packaging Society

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