Preliminary
Call for Papers
Abstract Deadline: September 1, 1999
International Symposium on Advanced Packaging Materials:
Processing, Properties and Interfaces
March 6-8, 2000
Chateau Elan
Braselton, Georgia
Sponsored by
IMAPS - International Microelectronics And Packaging Society
IEEE Components, Packaging and Manufacturing Technology Society
Packaging Research Center (PRC), Georgia Institute of Technology
Other Participating Societies
American Society of Metals
The American Ceramic Society
Society of Plastic Engineers
Materials Research Society
General Chair:
C.P. Wong, Ph.D., Georgia Institute of Technology
P: 404-894-8391; F: 404-894-9140
E-mail: cp.wong@mse.gatech.edu
Technical Program Co-chairs:
Prof. James E. Morris, SUNY Binghamton
P: 607-777-4774; 607-777-4464
E-mail: jmorris@binghamton.edu
Philip Garrou, Ph.D., Ph.D., Dow Chemical Company
P: 919-248-9261; F: 919-248-9265
E-mail: pegarrou@dow.com
| Tentative Sessions on: |
Adhesives
Bumping Materials & Processing
Chip Scale Packaging Materials
Integral Passive Materials
Interfacial Adhesion
Materials Process Control
Mechanics of Materials |
Microwave Materials
On-chip Interconnect Materials
Optoelectronics
High Density Substrates
Thermal Management Materials
Underfills & Encapsulant Materials
Wafer Level CSP |
To submit an Abstract please send your 200 word abstract by September 1, 1999 to:
Materials 2K
c/o IMAPS Program Management
1850 Centennial Park Drive
Suite 105
Reston, VA 20191-1517
Fax: 703-758-1066
E-mail: jmorris@imaps.org
