Advanced Technology Workshop on
Packaging of MEMS & Microsystems
Chicago Hilton & Towers, Chicago, Illinois
October 23-24, 1999

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Cosponsored by:
IMAPS - The International Microelectronics and Packaging Society
University of Arkansas

Endorsed by:
IEEE/CPMT and ASME

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Message from the Chair

The packaging of micro electro mechanical systems (MEMS) and other related microsystems is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and development have been completed on the packaging of these devices. This is despite the fact that packaging, hybrid/multi-chip module/monolithic, is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application-specific and greatly affected by its environment and packaging techniques. Many of these aspects are directly related to the materials and processes used in the packaging and integration processes. This workshop is a first active step to initiate a dialogue in this interdisciplinary field. The sessions in this workshop will be of significant use to scientists and engineers in various industries, national laboratories and universities developing related technologies for a range of applications. As a special part of this year's program we have included a Motorola session, presenting a Case Study of a MEMS product from concept to completion.

Ajay P. Malshe & Karen Markus

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General Chair: Ajay P. Malshe, University of Arkansas

Technical Program Chair: Karen Markus, Cronos Integrated Microsystems, Inc.

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WORKSHOP PROGRAM
Saturday, October 23
Registration: Noon – 9 pm Session I: Introduction and Overview 1 pm – 3 pm Introduction to Packaging of MEMS & Microsystems Ajay Malshe, University of Arkansas 1 pm - 1:10 pm Introduction to MEMS Karen Markus, Cronos Integrated Microsystems Commercial Packaging for MEMS and Microsystems TBD, Amkor MEMS Packaging CAD John Gilbert, Microcosm MEMS Reliability and Testing Bill Miller, Sandia National Laboratories Break: 3 pm – 3:30 pm	Session II: Pressure Sensors for Automotive Applications: A Motorola Case Study 3:30 pm – 9 pm Overview of Pressure Sensors in Automotive Applications Albert Chiou, Automotive and Industrial Electronics Group, Motorola, Inc. A Capacitive Absolute Pressure Sensor with Ability to Sense its Own Structural Integrity and Predict Service Life Steven Chen, Anita Brandes, Automotive and Industrial Electronics Group, Motorola, Inc. Reception/Dinner: 6 pm – 7:30 pm A Palladium Plated Lead Frame for an Automotive Application Joe Wang, Automotive and Industrial Electronics Group, Motorola, Inc. A Stress Singularity Approach for the Prediction of Fatigue Crack Initiation in Adhesive Bonds Didier R. Lefebvre, Automotive and Industrial Electronics Group, Motorola, Inc. An Experiment and Simulation-based Reliability Study for Carbon-Monoxide (CO) Silicon Membrane Sensor Yifan Guo, Tom Lee, Advanced Interconnect System Laboratories, Semiconductor Products Sector, Motorola, Inc.
Sunday, October 24
Breakfast: 8 am – 9 am Session III: Environments 9 am – Noon Ceramic Packaging for Microsystems Hiroshi Matsumoto, Kyocera MEMS Packaging Backend Processes Srinivas Tadigadapa, ISSYS Microencapsulation Shells for MEMS Packaging Liwei Lin, University of California-Berkeley Break: 10:30 am – 10:45 am Packaging of Thermal and Fluidic Sensors Tom Kenny, Stanford Product Neutral Packaging Tom Schwimert, Texas Instruments PANEL DISCUSSION Lunch: 12:30 pm – 2 pm	Session IV: Methods and Applications 2 pm – 5 pm The Packaging of MEMS Devices for Spacecraft Applications - Long Survival and Reliabiltiy Issues Saverio A. D’agostino, L. Miller, T. Tang, Jet Propulsion Laboratory Packaging for Harsh Environments Nadim Maluf, NovaSensors Flip Chip Assembly for MEMS Packaging YC Lee, Colorado University-Boulder MEMS Packaging in Korea Kyung Paik, KAIST MEMS/MST Exponential Growth based on Road-Mapping the Microbricks Architecture Adolfo Gutierrez, Memstar Ccorporation

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