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Advanced Technology Workshop on
Packaging of MEMS & Microsystems
Chicago Hilton & Towers, Chicago, Illinois
October 23-24, 1999


Cosponsored by:
IMAPS - The International Microelectronics and Packaging Society
University of Arkansas

Endorsed by:
IEEE/CPMT and ASME


Message from the Chair

The packaging of micro electro mechanical systems (MEMS) and other related microsystems is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and development have been completed on the packaging of these devices. This is despite the fact that packaging, hybrid/multi-chip module/monolithic, is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application-specific and greatly affected by its environment and packaging techniques. Many of these aspects are directly related to the materials and processes used in the packaging and integration processes. This workshop is a first active step to initiate a dialogue in this interdisciplinary field. The sessions in this workshop will be of significant use to scientists and engineers in various industries, national laboratories and universities developing related technologies for a range of applications. As a special part of this year's program we have included a Motorola session, presenting a Case Study of a MEMS product from concept to completion.

Ajay P. Malshe & Karen Markus


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General Chair: Ajay P. Malshe, University of Arkansas

Technical Program Chair: Karen Markus, Cronos Integrated Microsystems, Inc.


WORKSHOP PROGRAM
Saturday, October 23
Registration: Noon – 9 pm

Session I: Introduction and Overview
1 pm – 3 pm

Introduction to Packaging of MEMS & Microsystems
Ajay Malshe, University of Arkansas
1 pm - 1:10 pm

Introduction to MEMS
Karen Markus, Cronos Integrated Microsystems

Commercial Packaging for MEMS and Microsystems
TBD, Amkor

MEMS Packaging CAD
John Gilbert, Microcosm

MEMS Reliability and Testing
Bill Miller, Sandia National Laboratories

Break: 3 pm – 3:30 pm

Session II: Pressure Sensors for Automotive Applications: A Motorola Case Study
3:30 pm – 9 pm

Overview of Pressure Sensors in Automotive Applications
Albert Chiou, Automotive and Industrial Electronics Group, Motorola, Inc.

A Capacitive Absolute Pressure Sensor with Ability to Sense its Own Structural Integrity and Predict Service Life
Steven Chen, Anita Brandes, Automotive and Industrial Electronics Group, Motorola, Inc.

Reception/Dinner: 6 pm – 7:30 pm

A Palladium Plated Lead Frame for an Automotive Application
Joe Wang, Automotive and Industrial Electronics Group, Motorola, Inc.

A Stress Singularity Approach for the Prediction of Fatigue Crack Initiation in Adhesive Bonds
Didier R. Lefebvre, Automotive and Industrial Electronics Group, Motorola, Inc.

An Experiment and Simulation-based Reliability Study for Carbon-Monoxide (CO) Silicon Membrane Sensor
Yifan Guo, Tom Lee, Advanced Interconnect System Laboratories, Semiconductor Products Sector, Motorola, Inc.

Sunday, October 24
Breakfast: 8 am – 9 am

Session III: Environments
9 am – Noon

Ceramic Packaging for Microsystems
Hiroshi Matsumoto, Kyocera

MEMS Packaging Backend Processes
Srinivas Tadigadapa, ISSYS

Microencapsulation Shells for MEMS Packaging
Liwei Lin, University of California-Berkeley

Break: 10:30 am – 10:45 am

Packaging of Thermal and Fluidic Sensors
Tom Kenny, Stanford

Product Neutral Packaging
Tom Schwimert, Texas Instruments

PANEL DISCUSSION

Lunch: 12:30 pm – 2 pm

Session IV: Methods and Applications
2 pm – 5 pm

The Packaging of MEMS Devices for Spacecraft Applications - Long Survival and Reliabiltiy Issues
Saverio A. D’agostino, L. Miller, T. Tang, Jet Propulsion Laboratory

Packaging for Harsh Environments
Nadim Maluf, NovaSensors

Flip Chip Assembly for MEMS Packaging
YC Lee, Colorado University-Boulder

MEMS Packaging in Korea
Kyung Paik, KAIST

MEMS/MST Exponential Growth based on Road-Mapping the Microbricks Architecture
Adolfo Gutierrez, Memstar Ccorporation


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