|
|
HOT
|
| President | Paul Van Loan, Cupertino, CA |
| President-Elect | Gregory Caswell, Xetel Corp., Austin, TX |
| VP of Technology | Dr. Len Schaper, Univ. of Arkansas, Fayetteville, AR |
| VP of Information Dissemination | Ronald Baldan, AccuTech Laser, San Diego, CA |
| VP of International Development | Dr. R. Tummala, Packaging Res. Ctr., Atlanta, GA |
| Organizational Director | James Lawson, C-MAC Industries, Durham, NC |
| Treasurer | John L. (Larry) Leicht, Motorola, Libertyville, IL |
| First Past President | James T. Cook, Promex Inds., Santa Clara, CA |
| Mid-Atlantic Regional Director | Dr. Bruce Romenesko, APL, Laurel, MD |
| North Central Regional Director | Dennis Keyfauver, Raytheon, Fort Wayne, IN |
| Northeast Regional Director | James Alexander, Heraeus/Cermalloy, Bedford, NH |
| Northwest Regional Director | Ray Petit, Silicon Coast Assocs., San Jose, CA |
| South Central Regional Director | Sue Bagen, Adv. Process Concepts, Austin,TX |
| Southeastern Regional Director | Robert Heistand, AVX Corp., Myrtle Beach, SC |
| So. California Regional Director | Phil Zulueta, JPL, Pasadena, CA |
| Southwestern Regional Director | Clark Fisher, Heraeus/Cermalloy, Tempe, AZ |
"IMAPS is extremely fortunate to have such a strong group of leaders to begin the next decade in microelectronics and electronic packaging. Each of these elected officers and directors has proven themselves on the local level as a member, chapter activist, and future leader of IMAPS. I look forward to working with our 2000 team," stated President Van Loan.
Elections are held annually and members from all over the world are eligible to run for office and to cast their ballot for their choice of leadership.
Founded in 1967, IMAPS is a leading international microelectronics and electronic packaging society with professional members in 25 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
########
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, Virginia, September 15, 1999
IMAPS has announced the following recipients of the Society's 1999 International Awards:
Daniel C. Hughes Memorial Award
Andy London, Director of Technical Services,
Heraeus, Inc./Cermalloy Division, West Conshocken, PA
Andy London was chosen to receive the Society's highest award for being a dedicated member of IMAPS and MMRC who has made outstanding contributions to IMAPS through his technical achievements, visionary leadership, and ongoing support.
William D. Ashman Award
Christian Belady, Senior Thermal Analyst,
Hewlett-Packard Company, Richardson, TX
Christian Belady received the Ashman Award in recognition of his outstanding contributions to the Electronics Packaging Industry and IMAPS.
John A. Wagnon, Jr. Technical Achievement Award
Lee Levine
Kulicke & Soffa Industries, Inc., Willow Grove, PA
The Wagnon Technical Achievement Award was given to Lee Levine because he has been a major contributor in wirebonding technology, particularly in the development of processes for the production of TSOP packages and CSP area array packages using low loop height bonding without which the package configurations could not be produced.
Corporate Recognition Award
Scrantom Engineering, Inc., Costa Mesa, CA
In recognition of its innovative work developing and providing Low Temperature Cofired Ceramic technology and processes, and its long-standing support of IMAPS and the Educational Foundation.
Fellows of the Society
Arthur W. Dobie, Technical Service Manager,
Microcircuit Engineering Corp., Mount Holly, NJ
Art Dobie has been an active member of IMAPS since 1984. He was Exhibits Co-Chair of the 1997 International Symposium. He created the annual Silent Auction and was its first Chair in 1997. Art has held numerous offices in the Keystone Chapter including the Presidency in 1997-98 and has presented more than ten papers at various conferences and symposia worldwide.
Dr. Koji Nihei
Oki Electric Industry Co., Inc., Tokyo, Japan
Dr. Nihei has been a longtime member of IMAPS Japan and has served as Vice President, Executive Director and Director. He has been a member of the IEMT/IMC Advisory Panel since 1992 and a member of the IMAPS Technical Committee since 1996. Dr. Nihei has published four books, many papers and has received a number of international society awards. He been active in the Pan Pacific Symposium since its inception.
IMAPS awards are given annually and are chosen from candidates that are nominated by their fellow members and meet certain Award Criteria.
Dr. Philip Garrou, Past President and Chair of the 1999 Awards Committee, said that "the entire Awards Committee was impressed by the caliber of this year's nominees and worked diligently to ensure that the best of the candidates received the 1999 honors."
The 1999 IMAPS Awards presentation will take place on October 26, 1998, at the IMAPS 32nd International Microelectronics Symposium at the Chicago Hilton and Towers, Chicago, IL.
Founded in 1967, IMAPS is a leading international microelectronics and electronic packaging society with professional members in 25 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
########
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, Virginia, October 6, 1999
The 10,000 member International Microelectronics And Packaging Society (IMAPS) has just elected Dr Paul Van Loan of Cupertino, CA, as President for the year 2000.
"IMAPS is known for the high quality of its technical presentations and the name IMAPS is synonymous with educational opportunities and information on the latest developments in the fields of microelectronics and electronic packaging. We have an ongoing mission of developing chapters and affiliations worldwide and I am looking forward to carrying the IMAPS message into the 21st Century," stated Van Loan.
Dr. Van Loan received his BS and MS degrees in Earth Sciences and Mineralogy from the University of Toronto, and a Ph.D. degree in X-ray Crystallography from McGill University. For the past 21 years, he worked at Hewlett Packard, most recently as Project Manager for IC Packaging R&D in the Integrated Circuits Business Division. He retired from Hewlett-Packard in July 1998. Paul has been a member of IMAPS for 30 years. He has been active in the Technical Program Committees of ECTC, the IMAPS MCM conference in Denver and the IEEE MCM conference in Santa Cruz. He served as the Technical Co-Chair and Chair, respectively, of the 1995 and 1996 International MCM conferences in Denver. Dr. Van Loan was elected as a Fellow of the IEEE in 1997. He has authored more than 35 papers and holds several patents on various topics in Materials Science and Microelectronics. In 1990, he received the John A. Wagnon Award for Technical Achievement from IMAPS.
Founded in 1967, IMAPS, is a leading, international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
########
Contact: Tim Avila, Miller Freeman, Inc.
Ph: 415-905-2772; E-Mail: tavila@mfi.com
San Francisco, CA , September 14, 1999
Miller Freeman and the International Microelectronics and Packaging Society (IMAPS) announced today the launch of HD International (High Density International), an international conference and trade show on high-density interconnect and systems packaging. The event, sponsored by IMAPS and Miller Freeman, will focus on issues surrounding the growing market for smaller and more powerful electronic equipment and will present solutions-oriented sessions on the application of high-density packaging.
HD International will be held April 26 - 28, 2000, at the Adams Mark Hotel in Denver, Colorado. It replaces the previous HDP/MCM Denver and ISPS San Diego conferences produced by IMAPS. "HD International is the next evolution of high-density interconnect and systems microelectronics of the Denver conference," said Jim Cook, president of IMAPS, "This partnership will allow us to provide attendees with solutions that enable product realization and improvement through the application of high-density packaging and system integration technologies."
The event will be comprised of a technical conference and an exposition. The conference program will focus on approximately 15 broad topics from die-level test, assembly and packaging to high-density printed wiring boards and substrates to systems-level issues. Individual sessions will cover application requirements, technology capabilities, design and processes. The exposition will showcase the latest technologies and services from over 100 leading-edge companies.
"As the market for smaller and more powerful electronics continues to grow and evolve, electronics professionals must understand a much broader range of packaging issues," explained Laura Finnerty, show director for Miller Freeman. "This event will provide attendees a forum for exploring the best ways to incorporate high-density ICs and components into products."
About IMAPS
Founded in 1967, IMAPS is a leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually.
About Miller Freeman, Inc.
A wholly owned subsidiary of United News & Media plc (UNEWY), Miller Freeman is the world's largest trade show producer and a leading publisher of technical and industry-specific magazines. With divisions in Asia, Europe, the U.K. and the U.S., Miller Freeman produces more than 450 exhibitions and conferences and nearly 440 publications, including 270 magazines, 260 web sites and a fast-growing portfolio of online services. Miller Freeman's high-tech portfolio now spans 13 market sectors with 35 trade shows and conferences, 65 publications, and 100 web sites. For more information, visit the Miller Freeman web site at www.mfi.com.
########
Contact: Lori Bookbinder, Tattar Cutler-LD&B
Ph: (215) 957-0300; E-Mail: Lori.Bookbinder@ldb.com
Reston, VA, August 30, 1999
Members of the Ceramic Interconnect Initiative (CII), experts in the field of ceramic interconnect technology, will present a wide range of technical papers showcasing ceramic solutions at the 32nd International Symposium on Microelectronics (IMAPS '99). This premier industry conference will be held from October 26-28 at the Chicago Hilton & Towers in Chicago. The conference is sponsored by the International Microelectronics And Packaging Society (IMAPS). For a complete agenda of presentations and events, visit IMAPS on the web at http://www.imaps.org/imaps99.
Ceramic interconnect technology provides designers with the ability to develop cost-effective solutions to packaging and interconnect problems that require performance at high frequencies, high density interconnect, small package size and performance in harsh environments. Ceramic solutions include unique capabilities to integrate passive components and are well suited for many evolving applications, including those in portable wireless, wireless infrastructure, satellite communications and automotive electronics.
Experts will describe advances in ceramic interconnect technology in key areas including Wireless/RF, Automotive, Integrated Passives, Low Temperature Cofired Ceramic (LTCC) Materials and Thick Film. The papers include:
Wireless/RF
Automotive
Integrated Passives
Low Temperature Cofired Ceramic (LTCC)
Thick Film
The Ceramic Interconnect Initiative (CII) of the International Microelectronics And Packaging Society (IMAPS) is dedicated to increasing the awareness of the benefits of ceramic technology among OEM designers. The CII consists of volunteers from the top microelectronics and electronic packaging companies in the world. IMAPS actively promotes the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the advancement of the society's portfolio of technologies. For more information on CII and IMAPS, visit the IMAPS Web site at www.imaps.org or call 1-888-GO-IMAPS
########
Contact: Lori Bookbinder, Tattar Cutler-LD&B
Ph: (215) 957-0300; E-Mail: Lori.Bookbinder@ldb.com
Reston, VA, August 24, 1999
Members of the Ceramic Interconnect Initiative (CII) of the International Microelectronics And Packaging Society (IMAPS) will present technical papers at the Wireless Symposium/Portable by Design Conference being held September 21-24 in New Orleans.
The authors of the papers come from companies that are members of the Ceramic Interconnect Initiative, including DuPont, Heraeus Inc., Ferro, Remtec and Sorep. Sessions on packaging for wireless are sponsored by the CII and the International Wireless Packaging Consortium (IWPC).
Packaging for wireless products is a "system level" problem. One can no longer consider a device level package connected to a board or substrate as meeting the needs of the product designer. Presently, design tools combined with materials properties, manufacturing processes and models fall far short in meeting current and future needs of the marketplace, for all levels of wireless and RF products. These sessions bring together experts who will address advances in materials and packaging technology for portable wireless devices and infrastructure equipment.
The CII will present the following papers:
The Ceramic Interconnect Initiative (CII) of the International Microelectronics And Packaging Society (IMAPS) is dedicated to increasing the awareness of the benefits of ceramic technology among OEM designers. The CII consists of volunteers from the top microelectronics and electronic packaging companies in the world. IMAPS actively promotes the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the advancement of the society's portfolio of technologies.
########
Contact: Lori Bookbinder, Tattar Cutler-LD&B
Ph: (215) 957-0300; E-Mail: Lori.Bookbinder@ldb.com
Reston, VA, July 13, 1999
The Ceramic Interconnect Initiative (CII) of the International Microelectronics And Packaging Society (IMAPS) has developed a ten-year ceramic industry "roadmap," a document that describes how the features of ceramic technology deliver benefits for a wide variety of electronic packaging and interconnect applications. The roadmap analyzes the current state and forecasts future requirements of the use of ceramic in electronic packaging.
The purpose of the roadmap is to demonstrate the competitive advantages of ceramic technologies and their potential uses in the design, development, manufacturing and marketing of microelectronics applications over the next decade. It is intended to serve as a reference document to guide investment in research, development, and deployment for the ceramic technology infrastructure. Copies of the roadmap are available by contacting the National Electronics Manufacturing Initiative (NEMI) at www.nemi.org or the IPC at www.ipc.org.
"Ceramic substrate interconnection technologies are important, timely and continuously improving to meet changing market requirements," said Samuel J. Horowitz, chairman of the CII. "Packaging and system designers have limited awareness of the benefits and capabilities of ceramic technology, which include reduced costs, improved reliability and faster time to market. This roadmap explains the benefits and uses of ceramic technologies and offers OEM designers a viable alternative when considering electronic packaging solutions."
The Ceramic Interconnect Initiative (CII) of the International Microelectronics And Packaging Society (IMAPS) is dedicated to increasing the awareness of the benefits of ceramic technology among OEM designers. The CII consists of volunteers from the top microelectronics and electronic packaging companies in the world. IMAPS actively promotes the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the advancement of the society's portfolio of technologies. For more information on CII and IMAPS, visit the IMAPS Web site at www.imaps.org or call 1-888-GO-IMAPS.
########
Contact: Samuel J. Horowitz, Chairman of the Ceramic Interconnect Initative
ph: 919-248-5752; E-Mail: Samuel.J.Horowitz@usa.dupont.com
Reston, VA, April 26, 1999
During the 60s, 70s and 80s, thick film ceramic technology earned a reputation for having high reliability and high cost due to its use in a variety of performance driven, low-volume military and aerospace applications. Times have changed and so too has ceramic technology.
Today, advanced ceramic technology is the technology of choice for a whole new generation of designers. Designers of cell phones, pagers, anti-lock braking systems, automotive engine controllers and digital cameras have all rediscovered the benefits of ceramic. Ceramic technology's electrical property stability, high thermal dissipation, and high resolution and high definition conductor lines and spaces and the ability to integrate passive components make it an ideal solution for many of today's consumer electronic devices.
To steal a phrase - it's not your father's ceramic technology.
To help meet the growing demand among designers for information about ceramic technology, the International Microelectronics And Packaging Society, IMAPS (formerly ISHM) formed and supports the Ceramic Interconnect Initiative (CII). The CII members include representatives from companies at all levels of the industry supply chain, including circuit manufacturers, systems houses and suppliers of substrates, materials and services. The goal of the CII is to educate OEM designers about the benefits of ceramic technology.
A number of seminars and workshops for OEM designers have also been organized, including one upcoming at the IEEE MTT-S meeting in Anaheim, Calif. the week of June 14.
The establishment of the CII is a critical development for the technology and the electronics design community. People who are interested in the CII can obtain information at www.IMAPS.org/cii/cii.htm.
########
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, VA, March 8, 1999
Leon M. Lederman, Nobel Prize winning Physicist and the second Director of Fermilab will be the Keynote Speaker at IMAPS '99, October 26-28, 1999, at the Chicago Hilton and Towers, Chicago, IL.
Dr. Lederman's experiences are linked with his long-term affiliation with Columbia University. His early research in high-energy physics brought him into the national science policy circles and in 1963 he proposed the idea that became the National Accelerator Laboratory.
In 1977, Dr. Lederman led the team that discovered the bottom quark at Fermilab. The following year he became Director and his administration brought Fermilab into its position of scientific prominence. By 1983, the achievement of the world's most powerful superconducting accelerator, the Tevatron, brought Fermilab into worldwide prominence. In 1988, Dr. Lederman was awarded the Nobel Prize for Physics.
"IMAPS is indeed honored to have a person of Dr. Lederman's stature as the Keynote Speaker at the 32nd International Microelectronics Symposium. For the first time in our history, we are introducing a Nobel Laureate to our membership and are looking forward to his comments to our membership," stated James T. Cook, IMAPS President.
Founded in 1967, IMAPS is a leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the microelectronics and electronic packaging industries and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, VA, February 18, 1999
The Microelectronics Marketing Research Council (MMRC), an IMAPS sponsored organization, will meet in Baltimore, MD, June 21-23, 1999. The MMRC Workshop theme is "Future Communication Networks - Trends and Tradeoffs (Twisted Pair, Co-Ax Cable, Fiber Optic, Satellite, Wireless).
"The communications industry is literally changing our world and the way we live at breakneck speed. Today, with less than 50% of the world's population having access to telephone service, and the rest of us demanding higher and higher bandwidth on demand, the communications infrastructure industry has it's work cut out for it.
What are the trends and tradeoffs for the various means of bringing communications to the world's population, in the next 10-20 years? Who is/is not expected to make money in the future? How will these trends and tradeoffs effect the microelectronics and packaging industry? What are the expected and desired developments needed to meet these needs?
By bringing together numerous industry leaders at many levels of the supply chain, the MMRC will cover these and other topics in this groundbreaking, international, Microelectronics Marketing Research Council Workshop, " stated Don Brown, Director of the International Wireless Packaging Consortium and Program Chair for the MMRC Workshop.
Sessions include: "Overview of Network and Switching Systems", "Panel Session - Trends and Tradeoffs in Various Network Technologies and Topologies", "Packaging Issues Session", and the MMRC Trademarked "Wall Street Session"
Founded in 1967, IMAPS (International Microelectronics And Packaging Society) is a leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, VA, October 6, 1998 -
- The 10,000 member International Microelectronics And Packaging Society (IMAPS) has just elected Dr Paul Van Loan of Cupertino, CA, as President for the year 2000.
"IMAPS is known for the high quality of its technical presentations and the name IMAPS is synonymous with educational opportunities and information on the latest developments in the fields of microelectronics and electronic packaging. We have an ongoing mission of developing chapters and affiliations worldwide and I am looking forward to carrying the IMAPS message into the 21st Century," stated Van Loan.
Dr. Van Loan received his BS and MS degrees in Earth Sciences and Mineralogy from the University of Toronto, and a Ph.D. degree in X-ray Crystallography from McGill University. For the past 21 years, he worked at Hewlett Packard, most recently as Project Manager for IC Packaging R&D in the Integrated Circuits Business Division. He retired from Hewlett-Packard in July 1998. Paul has been a member of IMAPS for 30 years. He has been active in the Technical Program Committees of ECTC, the IMAPS MCM conference in Denver and the IEEE MCM conference in Santa Cruz. He served as the Technical Co-Chair and Chair, respectively, of the 1995 and 1996 International MCM conferences in Denver. Dr. Van Loan was elected as a Fellow of the IEEE in 1997. He has authored more than 35 papers and holds several patents on various topics in Materials Science and Microelectronics. In 1990, he received the John A. Wagnon Award for Technical Achievement from IMAPS.
Founded in 1967, IMAPS, is a leading, international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, VA, September 1, 1998 -
James (Jim) T. Cook, a resident of northern, California, and Vice President of Sales and Marketing at Promex Industries, Inc., Santa Clara, CA, has been elected 1999 President of the International Microelectronics And Packaging Society (IMAPS). He will take office on November 2, 1998, at the 31st International Microelectronics Symposium being held at the San Diego Convention Center.
"The focus of IMAPS for the next year will be to strengthen our North American Chapters and Organization members that have been the foundation of our Society since the beginning while maintaining the development and progress we've made in the international arena; furthermore, we will establish a 5 year strategic plan for the Society" stated Cook.
Cook has been active in IMAPS for over 20 years. He was the two term President of the Northern California Chapter, their Education Chair, and was responsible for starting student chapter of IMAPS in the Northern California Region. He served as President of the Southwest Chapter and founder and four year Chair of the Sensors Committee. He has presented numerous papers at the international symposia of IMAPS, SMTA , SME and holds two patents.
Jim is Vice President of Sales and Marketing with Promex Industries, Inc.. His prior positions include Director of Operations at Ferro Corp.'s Electronic Materials Division, Director of Operations for SenSym, Hybrid Development Manager for Lucas Novasensor, Product Development Manager for Schlumberger; and Quality and Reliability Supervisor for the Advanced Microelectronics Group of Texas Instruments. He holds a Masters in Business and Bachelors in Chemistry. Jim is active in the US Army Reserve and holds the position of Battalion Commander, Lieutenant Colonel and is responsible for joint services training of Army, Navy, and Air Force units in the 12 western states in Nuclear, Biological, Chemical Warfare and Defense operations..
Founded in 1967, IMAPS, is a leading, international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
########
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, VA, July 1, 1998 -
IMAPS has changed the name of its MCM Conference to The International Conference and Exhibition on High Density Packaging and MCMs. The change has been made to reflect the transformation that this conference has undergone over the past 2-3 years. The conference is the leading technology and industry event dedicated to the advancement of HDP and MCMs
René Coté, General Chair of this year's conference stated: "The conference was initially aimed exclusively at multichip modules. We then expanded its focus to include flip chips, chip scale packaging, known good die and high density interconnect on flex. This year, we are adding sessions on 3-D packaging, integrated passives and the emerging technologies of superconductors, exotic substrates and optical. The new name better reflects the expanded nature of the conference." The HDP and MCMs Denver '99 conference and exhibition will be held at the newly redecorated Adam's Mark Hotel in Denver Colorado April 7-9. The event is presented by IMAPS, the International Microelectronics and Packaging Society.
Founded in 1967, IMAPS is a leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, VA, September 1, 1998 -
James (Jim) Alexander of Bedford, NH, has been elected for his second consecutive term as Northeast Regional Director of the International Microelectronics And Packaging Society (IMAPS). Alexander will serve throughout 1999 and 2000. Alexander is National Accounts Manager at Heraeus, Inc. - Cermalloy Division in Bedford, NH, and is responsible for sales in the Northeast. Jim began his career with Alloys Unlimited which was bought by Plessey EMD which was acquired by Heraeus in 1992. During the past 26 years, Jim has been a QC Engineer, QC Manager, Sales Engineer, Regional Sales Manager, and in 1995 was appointed to National Accounts Manager.
Jim has been a member of IMAPS for the past 22 years and has been active with the New England Chapter. He began his relationship with IMAPS by attending meetings as an exhibitor in 1975. In 1988 Jim was elected as the New England Chapter's Membership Chair. He was also Secretary and served as the Chapter President in 1992. He has worked closely with other chapters in the Northeast and helped increase membership and organize meetings throughout the region. An important activity for Jim is his relationship with the colleges and universities in the Region promoting IMAPS to the students and faculty.
Jim holds an A.A.S. degree from Alfred State College/Suffolk Community College and a B.S. in Electrical Engineering from Hofstra University.
Founded in 1967, IMAPS, is a leading, international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
Contact: Ann Bell, IMAPS Public Relations
Ph: 408-323-5560; E-Mail: abell@imaps.org
Reston, VA, September 1, 1998 -
The International Microelectronics And Packaging Society (IMAPS) has just elected Dr. Leonard W. Schaper, Director of the High Density Electronics Center at the University of Arkansas, Vice President of Technology. Dr. Schaper will take office in November at the 32nd International Microelectronics Symposium at the San Diego Convention Center, San Diego, CA.
"IMAPS is known around the world for the high quality of its technical presentations and the name IMAPS is synonymous with educational opportunites and information on the latest developments in the fields of microelectronics and electronic packaging. I am honored to be elected to this important position," stated Schaper.
Dr. Schaper holds a B.S.E.E. from the Newark College of Engineering, an M.S.E.E. from the Massachusetts Institute of Technology, and a Ph.D. in Engineering Science from the New Jersey Institute of Technology. He taught both Electrical and Civil Engineering before joining AT&T Bell Labs., where he held several positions in electronic technology planning and technical management. He joined ALCOA Electronic Packaging in 1990 where he led its thin film work. Dr. Schaper joined the University of Arkansas faculty in 1992.
Dr. Schaper has authored more than 140 papers and presentations and he holds six patents. He has been a member of IEEE's Computer Packaging Committee for twelve years, was on the Board of Directors of IEPS and was President of IEPS in 1996. He is currently the IMAPS Chair for Continuing Education and was intrumental in the 1996 merger of IEPS and ISHM into IMAPS.
Founded in 1967, IMAPS is a leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS supports 30 educational opportunities annually that enable these professionals to increase their knowledge of current research and applications. Students have their own chapters and are eligible for annual grants from the IMAPS Educational Foundation.
Contact: Ann Bell
408-323-5560 or E-mail: abell@imaps.org
Reston, Va - International Microelectronics and Packaging Society (IMAPS) has currently unveiled three new books available for sale to the microelectronics and packaging industry for 1998. These books are:
"Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield" by George Harman ($65 IMAPS member and $115 nonmember). Extensively revised and updated, this classic book on wire bonding examines new high density interconnection techniques and bonds for higher yields. This "how-to" book is traditionally IMAPS’ best seller year after year and this revision will provide even more up to date information.
"Multichip Module Technology Handbook" by Philip Garrou, IMAPS President and Iwana Turlick ($100 IMAPS member and $150 nonmember). This book will serve as the standard MCM reference guide for the electronics industry. From design to manufacture to assembly and test, this book provides complete guidance to MCM technologies.
IMAPS Releases New Books
"Thermal Management Handbook for Electronic Assemblies" by Jerry Sergent and Al Krum ($90 IMAPS member and $140 nonmember). As a guide to comprehensive information on the thermal management of printed circuit boards, hybrid circuits and MCM's, this book comes complete with data tables and design examples.
Also, in February of 1998, IMAPS will be releasing "Thin Film Technology Handbook" by Dr. Aicha Elshabini-Riad and Fred Barlow ($90 IMAPS member and $140 nonmember). This book will be the most comprehensive source available on the preparation, characterization and emerging applications on thin film technologies. It will feature extensive new advances in MCM's and the basic principles and applications of thin film deposition techniques.
To order these books, call (888) GO-IMAPS or Contact: Ann Bell
408-323-5560 or E-mail: abell@imaps.org
IMAPS is dedicated to the advancement and expansion of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the promotion of the society's portfolio of technologies. With over 10,000 members worldwide, IMAPS was formed from the recent merger of ISHM and IEPS.
 |
[ Home ] [
IMAPS 2000 ] [ Chapters ] [ Calendar
] [ Publications ] [ Membership
]
IMAPS-International Microelectronics and
Packaging Society
|
NEWS
