General Chair: Jim Drehle, Hewlett-Packard
General Co-chair: Christian Belady, Hewlett-Packard
HDP Technical Program Chair: Bill Petefish, W.L. Gore
ISPS Technical Program Chairs:Dan Bruner, Fitch; Gary Kromann, Motorola

Our Denver conference has been expanded this year to combine two popular and established conferences, HDP & ISPS - all under one roof! The premier High Density Packaging and International Systems Packaging Symposium will be held jointly to leverage their strengths and offer attendees a broad range of topics from the semiconductor to the electronic enclosure. The combined conference will be structured to bring you applications, technology and systems solutions required by twenty-first century products.

You are invited to submit an abstract to the premier conference on High Density Packaging. Papers are sought on the following topics:

Systems Packaging	High Density Packaging	Common
System Applications Portable, Desktop, Datacenter, Telecom, Medical, Space, Wireless, Automotive Data Center & Switch Room Infrastructure Power, HVAC, UPS, Back-up Power Electrical Design Signal, Power Distribution Electronic Enclosures Racks, Sheet Metal Cabinets, Plastics’ Impact on Design Harsh Environmental Design Automotive, Defense, Space, COTS Industrial Design Human Factors, Rapid Prototyping Interconnect Technology Connectors, Sockets, Cabling Regulatory Compliance Safety, Acoustics, EMI/EMC Design Shock and Vibration Thermal Management Fans/Air Movers, Heat Sinks, Thermoelectrics, Heat Pipes, Liquid Cooling, Refrigeration, Heat Exchangers	HDP Applications Computers, Portable/Wireless, Consumer, Automotive, Military, Telecomm, LAN Networks Design and Test Substrates, Assemblies, RF/Wireless, Chip/Substrate Wiring, Tradeoffs High Density Substrates Processing/Flex, Via Formation, Metallization, Lithography/Patterning, Process Integration Chip-Scale Packages Package Types, Applications Known Good Die/Assemblies Supply Strategies, Testing, Trends Integrated Passives Capacitors, Resistors, Inductors, Design Systems, Performance 3D Packaging Memory Arrays, Multiprocessors Packaging Materials Organic Dielectrics, Ceramic Dielectrics, Encapsulates, Substrates, Metals, Underfills High Density Interfaces Chip to Module (Wire Bond, Flip Chip), Module to Board (BGA, Flex)Common	Markets and Infrastructure Economic Studies, Market Trends, Technology Trends, Manufacturing Initiatives Modeling, Analysis and Experimentation Techniques Power/Signal Integrity, Thermal, Stress, Electrical Performance, Power Cycling Electrical Modeling/Simulation Concurrent Design & Analysis Emerging Technologies Superconductors, Exotic Substrates, Optical Interconnects, MEMS Reliability Capacitors, Resistors, Inductors, Design Systems, Performance, Failure Analysis, Defect Mechanisms Design/Software Tools Bumping Processes, Assembly, CFD, CAD, CAE, EDA

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