The 33rd International Symposium on Microelectronics will be held at the Hynes Convention Center, Boston, MA. It is sponsored by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted must represent original, previously unpublished work.
General Chair:
James G. Alexander,
Heraeus, Inc., Cermalloy Division
alex@4hcd.com
Technical Program Chair:
John W. Roman,
Raytheon Systems Company
John_W_Roman@res.raytheon.com
Abstract Cut-off Date: February 4, 2000
Notice of Acceptance: March 24, 2000
Final Manuscripts Due: June 1, 2000
Papers are being sought from, but not limited to, the following subjects:
Active Devices (Detectors, MEMs,Superconductors)
Automotive Electronics
Chip Scale Packages
Design, Modeling, Simulation
Flex Circuits
Flip Chip
HDTV
High Density Packaging
Laser Processing
Low Cost Production
Management & Marketing
Manufacturing Technologies
Medical Electronics
Microwave Packaging
Mobile Electronics
Optoelectronics
Polymeric Materials
Power Packaging
Printed Wiring Boards
Quality
Reliability
Satellite Communications
Sensors
Soldering/Welding/Brazing
Surface Mount Technology
Thermal Management
Thick Film Materials
Thin Film Materials
Wireless Packaging
Cash Awards Offered
To reward exceptional work, IMAPS offers awards based on technical content, originality and applicability to current issues. Awards are presented in the following areas:
Best Paper of the Symposium Award
Cash Award
IMAPS offers a cash award of $2000 for the Best Paper of the Symposium. The IMAPS Technical Committee chooses the Best Paper based upon evaluations submitted by the members of the Technical Subcommittees and the Symposium Session Chairs.
Outstanding Paper Award
Cash Award
IMAPS offers a cash award of $500 each for two (2) papers designated as Outstanding Papers of the Symposium. The IMAPS Technical Committee chooses the two (2) Outstanding Papers based upon evaluations submitted by the members of the Technical Subcommittees and the Symposium Session Chairs.
Best Paper of Session
These awards are based on technical quality and originality of written manuscripts. Only the Best of Session papers are considered for Best Paper of the Symposium and Outstanding Paper awards.
To submit a paper, send your 250-300 word abstract by February 4, 2000. Your abstract must clearly describe the nature, scope, content, organization, key points and significance of the proposed paper. The paper must consist of work or results not previously published .
To Submit an Abstract
Submission of an abstract represents a commitment to submit a cleared manuscript by June 1, 2000. It also represents a commitment to either attend the conference or send a knowledgeable substitute who is qualified to present the material and answer questions regarding the reported work. A registration fee is associated with the Symposium and speakers are required to register. A special, reduced rate fee is offered to speakers and session chairs. Housing and transportation is the responsibility of the speaker. It is the author's responsibility to obtain internal company approvals consistent with the above terms and stated deadlines.
Authors will be notified of paper acceptance by March 24, 2000. Final manuscripts for publication are due June 1, 2000. IMAPS reserves the right to reject any manuscript for failure to comply with publication guidelines. Manuscripts which do not appear in the Proceedings will not be included in the final program and therefore cannot be presented at the Symposium. Camera-ready manuscripts are limited to six (6) pages, including diagrams, figures, and photographs. Excess page charges will be incurred for pages exceeding the limit.
The language for the Symposium and its publications is English. Copies of past Symposium Proceedings are available for purchase. Papers published in the Proceedings are eligible for publication in the IMAPS International Journal of Microcircuits & Electronic Packaging after peer review.
The 33rd International Symposium on Microelectronics is sponsored by the International Microelectronics And Packaging Society (IMAPS).
All abstracts submitted must represent original, previously unpublished work. All information requested on this form must be provided and submitted with your abstract before your abstract will be considered.
Paper Title _________________________________________________________________
Primary Author _______________________________________IMAPS ID#_____________
Company/Affiliation______________________________ Job Title___________
Address___________________________________________________________________
City_____________________________ State __________ Zip _____________
Country _________________________________
Phone _______________________________________________
Fax _________________________________________________
E-mail ________________________________________________________________________
Authors ________________________________________________________________________
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What is significantly different or original about your abstract topic?
________________________________________________________________________
________________________________________________________________________
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Your abstract may be submitted by mail, fax, or e-mail using the following address information:
IMAPS 2K Technical Program Committee
1850 Centennial Park Drive,
Suite 105
Reston, Virginia 20191-1517
P: 703-758-1060
F: 703-758-1066
E-mail: abstracts@imaps.org
Please include all information requested and clearly indicate IMAPS - 2000 on your submittal.