Call for Abstracts
International Advanced Technology Workshop on Flip Chip Technology
Sponsored by: IMAPS - International Microelectronics and Packaging Society
March 3-5, 2000
Chateau Elan Winery, Braselton, Georgia
(immediately preceding the Advanced Materials, Processes, Properties,& Interface Symposium)
Daniel F. Baldwin, Ph.D., General Chair
Georgia Institute of Technology
Packaging Research Center
813 Ferst Drive, NW
Atlanta, GA 30332-0405
P: 404-894-4135; F: 404-894-9342
E-mail: daniel.baldwin@me.gatech.edu
R. Wayne Johnson, Ph.D., Technical Chair
Auburn University
Laboratory for Electronics Assembly & Packaging
162 Broun Hall
Auburn, AL 36849
P: 334-844-1880, F: 334-844-1809
E-mail: johnson@eng.auburn.edu
