IMAPS 2000 International Symposium & Exhibition
Chapter Profiles
Call for Papers
Advanced Educational Opportunities
Employment Opportunities Marketplace
IMAPS Educational Foundation
Microelectronics Marketing Research Council
IMAPS Ceramic Interconnection Initiative
Discussion Boards
IMAPS National Leadership
Press Room
Advertising Opportunities
Contact IMAPS
Site Search
IMAPS FAQ



INFORMATION FOR PROCEEDINGS
AND CD-ROM AUTHORS

  • All illustrations and tables must be referred to in the text. Illustrations and tables must be provided separately and not incorporated into the text. All figure captions should be listed on a separate page(s).
  • Standard symbols and abbreviation must be used. All abbreviation must be defined when first used in the text. All subscripts, superscripts, Greek and other foreign letters, and mathematical symbols must be clearly rendered.
  • The use of trade and company names and proprietary terms should be avoided.
  • All dimensions are to use SI units, and English units may follow in parenthesis.
  • References are placed at the end of the paper, not as footnotes.

Conference Proceedings Manuscript Style
Your submission will be used for two different applications, and therefore needs to be submitted in two separate formats. One copy is for inclusion in the Proceedings of the Conference. The other format is for inclusion in a CD-ROM library ISHM is creating which will include all papers published by ISHM in Conference Proceedings, the International Journal of Microcircuits and Electronic Packaging , and the Advancing Microelectronics magazine.

  1. The submitted paper copy should be camera ready for direct publication into the Conference Proceedings. All figures should be inserted into the two column format as you want them to appear.
  2. Your package should also include a copy of your paper on diskette, single spaced, single column. The paper submitted on diskette should include no styles or formatting. No automatic footnotes should be used. No headers or footers should be used. Figures saved on the diskette must also be submitted each on a separate piece of paper .
  3. Reference all illustrations and tables. The initial reference to illustrations and tables in the text should be numerically sequential (e.g. Table 1, Table 2, Figure 1, Figure 2, Equation (1), Equation (2), ...etc.)
  4. References appear as a separate section at the end of the paper. In the text, the reference information is indicated by a numeral in a square bracket (e.g. [1]). Examples of correct references are:

    Paper from a Conference:
    [1] Jack John, "A Fine Presentation," Proceedings of the 1993 Electronic Components and Technology Conference (ECTC), Atlanta, Georgia, August 12-15, pp. 21-33, 1993.

    Journal Paper:
    [2] Jack John, "A Terrific Paper," Journal of Materials, Vol. 2, No. 3, pp. 22-33, November, 1992.

    Book:
    [3] Jack John, A Terrific Book, McGraw-Hill Publishers, second edition, New York, Chapter 2, pp. 22-33, 1993.

    Patent:
    [4] J.P. John, "A Great New Invention," U.S. Patent 2,825,028, September 21, 1994.

Address for Correspondence
With submission, include the original of the manuscript with complete illustrations to IMAPS Headquarters at the following address:

IMAPS
1850 Centennial Park Drive, Suite 105
Reston, Virginia 20191-1517
Phone: 703-758-5164, Fax: 703-758-1066

1. One copy of the manuscript formatted and ready for publication in the Proceedings.
2. A 3.5" disk with unstyled text in any of the popular word processing formats (Macintosh users please save your information on a high density diskette). Figures should be saved in JPEG, PCX, WMF, TIFF, BMP, EPS, DRW, PICT, or CDR and must also be submitted as hard, paper or photo copies.
3. Original drawings should be on 8"x11" drawing vellum or board.
4. Only the coordinate axes for graphs should be shown.
5. Tables must be typed or printed on separate sheets and the data within be intelligible.
6. Photographs should be glossy prints of good contrast. Slides and negatives are not acceptable. Try to avoid using color prints. Tag the back of the photos with the author's name and figure number. Indicate the top of each photo by printing "top" in the appropriate margin.
7. Enclose a technical biography and photograph for each author.
8. A copyright release form must accompany the manuscript. A paper must be approved and cleared for release by the company/institution/foundation prior to its submission to the Journal.


AGREEMENT FOR TRANSFER OF COPYRIGHT
Author's submitting papers for review and publication must complete this form and send it with the manuscript. If the submitted paper has been prepared as a "work for hire" for an employer, this form must be signed by the employer.

Copyright to the following article:

Title: ____________________________________________________

Author(s): ____________________________________________________

Is hereby transferred to the International Microelectronics And Packaging Society (IMAPS), effective on the date the manuscript is accepted by IMAPS for printing in any of its publications. For authors who are employees of the U.S. Government, its contractors, or grantees, IMAPS recognizes the right of the U.S. Government to retain a non-exclusive, royalty-free license to use the author's copyrighted manuscript for U.S. Government purposes.

Author's Signature: ___________________________________________________

Author's Printed Name: ___________________________________________________

Approving Authority's Signature: ___________________________________________________

Approving Authority's Title: ___________________________________________________

Date
: __________________________________________________

Calls for Papers

 
hot_news.gif (7666 bytes)

Your browser is not Java capable or Java has been disabled.



Back

barpack.gif (2730 bytes)

Top of Page

 

[ Home ] [ IMAPS 2000 ] [ Chapters ] [ Calendar ] [ Publications ] [ Membership ]
[ Virtual Trade Show ] [ Call For Papers ] [
Advanced Educational Opportunities ]
[ Microelectronics Marketing Research Council ] [ Ceramic Interconnect Initiative ]
[ IMAPS Educational Foundation ] [ Discussion Boards ] [ Market Place ] [ Search]
[ IMAPS Web FAQ  ] [ Leadership ] [ Press Room ] [ Advertising ] [ Contact IMAPS ]

 

IMAPS-International Microelectronics and Packaging Society
1850 Centennial Park Drive, Suite 105, Reston, VA 20191-1517
Phone: 888-464-6277 or 703-758-1060; Fax: 703-758-1066
The Microelectronics And Packaging Society

IMAPS Web Site Privacy Statement
© 1997-1999 IMAPS