Advanced Technology Workshop on
3D Packaging
Chicago Hilton & Towers, Chicago, Illinois
October 25, 1999
Cosponsored by:
IMAPS - The International Microelectronics and Packaging Society
NASA/Jet Propulsion Labs
California Institute of Technology
U.S. Air Force Phillips Laboratory
Message from the Chair
Both commercial mobile and portable computing applications, as well as low-cost micro-spacecraft applications, require dramatic reductions in the mass, volume and power consumption of all system electronics, while still demanding increase in functional performance. This need is driving towards higher levels of integration into the 3rd (Z) dimension, that is 3D-Packaging solutions.
The Fifth International Workshop on 3D-Packaging will continue to provide a focused forum for a detailed technical exchange of product information, new technology road maps, visions, and the latest ideas in 3D Packaging.
Co-chairs:
Tom Borden, Jet Propulsion Labs
Jim Lyke, USAF Phillips Laboratory
Register Online
General Chair: Tom Borden, Jet Propulsion Labs
Technical Program Chair: Jim Lyke, USAF Phillips Laboratory
WORKSHOP PROGRAM
Monday, October 25
8:00 am - 4:00 pm
Registration
8:30 am - 8:45 am
Introduction
Tom Borden, Jet Propulsion Labs and Jim Lyke, USAF Phillips Laboratory
Session I
8:45 am - 9:20 am
Miniaturization by Conventional Packaging
Bernd Gerlach, Institut fur Datinverarbeitungsanlagen/IDA Technische Universitat Braunschweig
9:20 am - 9:55 am
3-D Packaging Applications in Europe - Perspectives
Christian Val, 3D-Plus
9:55 am - 10:30 am
Investigation of Enabling Technologies for Building Electronic Packages using Polyimide Substrates for Deployable Lightweight Space Structures
Ajay Malshe, B.S. Park, Jed Young, Volkan Ozguz, W.D. Brown, University of Arkansas
10:30 am - 10:45 am
Break
10:45 am - 11:20 am
Historic Review and Current Trends in 3D Application of HDI Patterned Overlay
Ray Fillion, GE-Corporate Research
11:20 am - 11:55 am
Conceptual Framework for Giga Scale Architectures with Cellular Atomata and Ultrathin 3D Packaging
J. Lyke, USAF Phillips Lab
11:55 am - 1:00 pm
Lunch
Session II
3:30 pm – 9 pm
1:00 pm - 1:35 pm
Thermal Analysis and Test Results of the X33 3D Stack
Michael Blakely and Thomas Borden, Jet Propulsion Laboratory
1:35 pm - 2:10 pm
Overview of 3D Packaging Approaches
Derek Abbot, University of Adelaide
2:10 pm - 2:45 pm
System-in-a-Stack by Integration of Heterogeneous Components
Volkan Osguz, Irvine Sensors
2:45 pm - 3:00 pm
Break
3:00 pm - 3:35 pm
Integrated Avionics System (IAS), Integrating 3D Technology on a Panel
Don Hunter, Jet Propulsion Laboratory
3:35 pm - 4:10 pm
Technology Advancements in TSOP Stacking
Joel Mearing, Dense-Pac Microsystems, Inc.
4:10 pm - 4:30 pm
Final Thoughts
Register Online
IMAPS 99 Page
