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CALL FOR SPEAKERS
IMAPS ADVANCED TECHNOLOGY WORKSHOP
on
Integrated Passives Technology
April 28-29, 2000
Adam's Mark Hotel, Denver, CO
General Chair
Dr. Howard Clearfield
Director, Packaging Technology Development
Power Integrations, Inc.
477 N. Mathilda Avenue
Sunnyvale, CA 94086
TEL: +1 408-523-8818; FAX: +1 408-523-9300
Email: hclearfield@intarsiacorp.com
Technical Chair
Dr. Joseph Dougherty
Associate Professor of EE & Materials
Pennsylvania State University
167 Materials Research Lab
State College, PA 16802
TEL: +1 814-865-1638; FAX: +1 814-865-2326
Session Topics
Workshop Overview -As passive components often represent the largest number of components in a system and take up a significant percentage of board area, new approaches are needed to streamline cost and manufacturing. Building on the previous workshops, we will explore the most recent developments in this field with two days of focused presentations. Industry leaders will be invited to present an in-depth overview for each of the technical sessions. Abstracts are being solicited for presentation in the following technical areas:
Design Tools - As passive devices move from afterthought to mainstream in the designer's realm, EDA tools that can incorporate passives and their electrical models are needed. Additionally, reducing the time to market is key in the electronics world. Presentations exploring progress in this area are needed to provide awareness to the end user of new and future EDA capabilities.
Advances in High Frequency Passive Components - New developments in high frequency filters and new approaches to device miniaturization for portable electronics. High frequency passives have requirements different from those at lower frequencies. Development of electrical models, design libraries, novel device structures, fabrication of coplanar devices/geometry, etc. are welcome.
Antennas and Shielding - Materials and design issues for omnidirectional high gain and steerable antenna - both discrete and integrated will be explored. As frequencies increase and size and cost decrease, shielding is becoming more and more important. New materials, assembly techniques and analysis tools will be explored to further integrate these devices.
Materials/Fabrication Technologies - New developments in integrated passive device fabrication including stand alone components, MCMs, advanced PCBs, thin film, thick film, ceramic and laminated technologies; new applications of integrated passive electronics using high K dielectric, thin film magnetic and resistive ,materials, and polymer/ceramic PWBs. Design issues, new materials, characterization, packaging/assembly processes and economics.
If you would like to submit an extended abstract on an area of interest, please submit your 220 word abstract via email
to abstracts@imaps.org. If you have graphics or pictures as part of your extended abstract, please send them by January 7, 2000. express mail to:
IMAPS
Integrated Passives 2000 Call for Papers
1850 Centennial Park Drive
Suite 105
Reston, VA 20191-1517
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